Electrochemical measurements of passivation bilayers on copper in a CMP system

Journal of the Electrochemical Society

Volumn 151, Issue 10, 2004, Pages

  Carter, Melvin Keith ^a   Small, Robert ^a  

^a DuPont Electronic Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; AMMONIUM COMPOUNDS; BENZENE; CHEMICAL MECHANICAL POLISHING; COPPER; CORROSION; ELECTROCHEMICAL ELECTRODES; ORGANIC ACIDS; PASSIVATION; PH EFFECTS; SURFACE PHENOMENA;

BILAYERS; CHEMICAL CORROSION; ELECTROCHEMICAL MEASUREMENTS; ELECTROCHEMICAL MECHANICAL PLANARIZATION TOOL;

ELECTROCHEMISTRY;

EID: 8644268957     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1793731     Document Type: Article

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