A study on the electrochemical and the chemical mechanical polishing behaviors of W and Ti film

Journal of the Korean Physical Society

Volumn 50, Issue 3, 2007, Pages 643-649

  Seo, Yong Jin ^a   Park, Sung Woo ^a  

^a Daebul University   (South Korea)

Author keywords

CMP (chemical mechanical polishing); Electrochemical corrosion; Polishing selectivity; Potentiodynamic polarization; Removal rate

Indexed keywords

EID: 34147102772     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: 10.3938/jkps.50.643     Document Type: Article

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