Thermal strain and stress in copper thin films

Thin Solid Films

Volumn 262, Issue 1-2, 1995, Pages 142-153

  Vinci, R P ^a   Zielinski, E M ^a   Bravman, J C ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

Copper; Metallization; Semiconductors; Stress

Indexed keywords

CHARACTERIZATION; CRYSTAL ORIENTATION; INTERFACES (MATERIALS); MATHEMATICAL MODELS; METALLIZING; PASSIVATION; SEMICONDUCTOR MATERIALS; STRAIN; STRESS RELAXATION; STRESSES; THERMAL CYCLING; THIN FILMS;

BULK DEFORMATION MAPS; FILM TEXTURE; INTEGRATED CIRCUIT INTERCONNECTS; INTERFACE CONTROLLED DISLOCATION GLIDE; MECHANICAL RELIABILITY; PASSIVATION LAYER;

COPPER;

EID: 0029325729     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(95)05834-6     Document Type: Article

References (30)

1. Preparation of low resistivity Cu–1 at. %Cr thin films by magnetron sputtering
2. The yield stress of polycrystalline thin films
3. Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques