Effects of process variables on tin particle formation during metallorganic chemical vapor deposition

Electrochemical and Solid-State Letters

Volumn 13, Issue 7, 2010, Pages

  Na, Jeonggil ^a   Kim, Taesung ^a   Choi, Jae Boong ^a   Kim, Young Jin ^a   Shin, Yong Hyeon ^b   Yun, Ju Young ^b   Kang, Sang Woo ^b  

^a Sungkyunkwan University   (South Korea)

^b Korea Research Institute of Standards and Science   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CARRIER GAS; DEPOSITION TEMPERATURES; MEASURED RESULTS; NITRIDE PARTICLES; PARTICLE FORMATIONS; PLASMA CONDITIONS; PLASMA ENERGY; PROCESS VARIABLES; REFERENCE MATERIAL; SAMPLING POSITIONS; TETRAKIS; TIN PARTICLES;

MASS SPECTROMETRY; METALLORGANIC CHEMICAL VAPOR DEPOSITION; ORGANOMETALLICS; SODIUM CHLORIDE; TIN; TITANIUM; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY;

PLASMA DEPOSITION;

EID: 77956197204     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3418338     Document Type: Article

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