Incorporation of dust particles into a growing film during silicon dioxide deposition from a TEOS/O2 plasma

Aerosol Science and Technology

Volumn 39, Issue 5, 2005, Pages 408-414

  Shimada, Manabu ^a   Setyawan, Heru ^b   Hayashi, Yutaka ^a   Kashihara, Nobuki ^a,c   Okuyama, Kikuo ^a   Winardi, Sugeng ^b  

^a HIROSHIMA UNIVERSITY   (Japan)

^b DEPARTMENT OF ELECTRICAL ENGINEERING   (Indonesia)

^c JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSOLS; CONFINED FLOW; ELECTRIC CHARGE; SILICON COMPOUNDS; SUBSTRATES; THIN FILMS;

CHARGE FLUCTUATION; FILM DEPOSITION; GAS FLOW RATES; PARTICLE FORMATION;

DUST;

OXYGEN; SILICON DIOXIDE;

ARTICLE; DUST; ELECTRODE; FILM; FLOW RATE; GAS FLOW; PARTICLE SIZE; PLASMA; PRIORITY JOURNAL; SCANNING ELECTRON MICROSCOPY; VAPOR;

EID: 20044389302     PISSN: 02786826     EISSN: None     Source Type: Journal    
DOI: 10.1080/027868290950257     Document Type: Article

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