Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling

Microelectronics Reliability

Volumn 50, Issue 7, 2010, Pages 900-909

  Wunderle, B ^a,d   Dermitzaki, E ^a   Holck O ^a   Bauer, J ^a   Walter, H ^a   Shaik, Q ^b   Ratzke K ^b   Faupel, F ^b   Michel, B ^a   Reichl, H ^c  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

^b UNIVERSITY OF KIEL   (Germany)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^d CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL STRUCTURE; ELECTRONIC PACKAGING; LIFETIME PREDICTION; LOADING PARAMETERS; MODELING APPROACH; MOISTURE CONCENTRATION; MOISTURE DIFFUSION; MOLECULAR DYNAMICS SIMULATIONS; MULTISCALES; PARAMETRIC STUDY; QUANTITATIVE AGREEMENT; STRUCTURE-PROPERTY CORRELATION; SYSTEMATIC VARIATION; THERMO-MECHANICAL; THERMO-MECHANICAL TESTING;

DYNAMICS; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; MECHANICAL TESTING; MOISTURE; MOLECULAR DYNAMICS; RESINS; STRUCTURAL ANALYSIS;

EPOXY RESINS;

EID: 77955713685     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.02.024     Document Type: Conference Paper

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