On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 172-178

  Guojun, Hu ^a   Tay, Andrew A O ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

PRECURSORS; SOLDER REFLOW; STRAIN ENERGY; THERMO-MECHANICAL STRESS;

DELAMINATION; EUTECTICS; INTEGRATED CIRCUIT MANUFACTURE; LEAD; SOLDERING ALLOYS; STRAIN; TIN;

ELECTRONICS PACKAGING;

EID: 24644489276     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

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