Residual stress assessment of interconnects by slot milling with FIB and geometric phase analysis

Optics and Lasers in Engineering

Volumn 48, Issue 11, 2010, Pages 1113-1118

  Wang, Qinghua ^a   Xie, Huimin ^a   Liu, Zhanwei ^b   Lou, Xinhao ^b   Wang, Jianfeng ^c   Xu, Kewei ^c   Zhang, Zhaohui ^a   Liao, Jianhui ^a   Gu, Changzhi ^d  

^a TSINGHUA UNIVERSITY   (China)

^b BEIJING INSTITUTE OF TECHNOLOGY   (China)

^c XI'AN JIAOTONG UNIVERSITY   (China)

^d INSTITUTE OF PHYSICS   (China)

Author keywords

Finite element method; Focused ion beam; Geometric phase analysis; Interconnects; Residual stress

Indexed keywords

COPPER INTERCONNECTS; DISPLACEMENT FIELD; GEOMETRIC PHASE ANALYSIS; GRATING FABRICATION; IMAGING CAPABILITIES; INTERCONNECT LINES; INTERCONNECTS; STRESS RELEASE;

GEOMETRY; ION BEAMS; IONS; MILLING (MACHINING); RESIDUAL STRESSES;

FINITE ELEMENT METHOD;

EID: 77955561012     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.optlaseng.2009.12.006     Document Type: Article

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