FIB-based technique for stress characterization on thin films for reliability purposes

Microelectronic Engineering

Volumn 84, Issue 5-8, 2007, Pages 1783-1787

  Sabate N ^a   Vogel, D ^b   Keller, J ^b   Gollhardt, A ^b   Marcos, J ^a   Gracia I ^a   Cane C ^a   Michel, B ^b  

^a INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

^b FRAUNHOFER IZM   (Germany)

Author keywords

Focused ion beam; Hole drilling method; Residual stress; Slot milling

Indexed keywords

FOCUSED ION BEAMS; HOLE CONCENTRATION; RELIABILITY THEORY; RESIDUAL STRESSES; STRESS RELAXATION;

HOLE-DRILLING METHOD; MICROSCALE; SLOT MILLING;

THIN FILMS;

EID: 34247573449     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.01.272     Document Type: Article

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