Digital image correlation of nanoscale deformation fields for local stress measurement in thin films

Nanotechnology

Volumn 17, Issue 20, 2006, Pages 5264-5270

  Sabate N ^a   Vogel, D ^b   Gollhardt, A ^b   Marcos, J ^a   Gracia I ^a   Cane C ^a   Michel, B ^b  

^a INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIGITAL IMAGE CORRELATION; DISPLACEMENT FIELDS; IN SITU STRESS MEASUREMENT TECHNIQUES; NANOSCALE DEFORMATION FIELDS;

CORRELATION THEORY; IMAGE PROCESSING; MEASUREMENT THEORY; SCANNING ELECTRON MICROSCOPY; SILICON; SILICON NITRIDE; STRESS ANALYSIS;

THIN FILMS;

EID: 33749530727     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/17/20/037     Document Type: Article

References (20)

1. Hayazawa N, Motohashi M, Saito Y and Kawata S 2005 Highly sensitive strain detection in strained silicon by surface-enhanced Raman spectroscopy Appl. Phys. Lett. 86 (26)
2. Lepienski C M, Pharr G M, Park Y J, Watkins T R, Misra A and Zhang X 2004 Factors limiting the measurement of residual stresses in thin films by nanoindentation Thin Solid Films 251 447-52
3. Senez V, Armigliato A, Wolf I, Carnevale G, Balboni R, Frabboni S and Benedetti A 2003 A strain determination in silicon microstructures by combined convergent beam electron diffraction, process simulation, and micro-Raman spectroscopy J. Appl. Phys. 94 5574
4. Guckel H, Randazzo T and Burns D W 1985 A simple technique for the determination of mechanical strain in thin films with applications to polysilicon J. Appl. Phys. 57 1671-4
5. Li B, Tang X, Xie H and Zhang X 2004 Strain analysis in MEMS/NEMS structures and devices by using focused ion beam system Sensors Actuators A 111 57-62
6. Determining Residual Stresses by the Hole-Drilling Strain-Gage Method, ASTM Standard E837.
7. Prime B 1999 Residual stress measurement by successive extension of a slot: the crack compliance method Appl. Mech. Rev. 52 75-96
8. Kang K J, Yao N, He M Y and Evans A G 2003 A method for in situ measurement of the residual stress in thin films by using the focused ion beam Thin Solid Films 443 71-7
9. Sabaté N, Vogel D, Gollhardt A, Keller J, Michel B, Cane C, Gracia I and Morante J R 2006 Measurement of residual stresses in micromachined structures in a microregion Appl. Phys. Lett. 88 (7)
10. Vogel D, Gollhardt A and Michel B 2002 Micro and nanomaterials characterization by image correlation methods Sensors Actuators A 99 165-71
11. Sutton M A, Walters W J, Peters W H, Ranson W F and Neil SR 1983 Determination of displacements using an improved digital image correlation method Image Vision Comput. 1 133-9
12. Hutchinson J W and Suo Z 1992 Mixed mode cracking in layered materials Adv. Appl. Mech. 29 63-191
13. Dundurs J and Bogy D B 1969 Edge-bonded dissimilar orthogonal elastic wedges under normal and shear loading J. Appl. Mech. 36 650
14. Sze M S 1981 Physics of Semiconductors Devices (New York: Wiley)
15. Wortman J J and Evans R A 1965 Young's modulus, shear modulus, and poisson's ratio in silicon and germanium J. Appl. Phys. 36 (1)
16. Sabaté N, Vogel D, Gollhardt A, Keller J, Cane C, Gracia I, Morante JR and Michel B 2006 Measurement of residual stress by slot milling with focused ion-beam equipment J. Micromech. Microeng. 16 254-9
17. Gad-el-Hak M 2002 The MEMS Handbook (Boca Raton, FL: CRC Press)
18. Sun Y and Pang H L 2006 AFM image reconstruction for deformation measurements by digital image correlation Nanotechnology 17 933-9
19. Cho S, Crdenas-García J F and Chasiotis I 2005 Measurement of nanodisplacements and elastic properties of MEMS via the microscopic hole method Sensors Actuators A 120 163-71
20. Vogel D and Michel B 2001 Microcrack evaluation for electronics components by AFM nanoDAC deformation measurement Proc. IEEE-NANO 2001 (Maui, HI Oct. 2001) pp309-12