A discrete dislocation dynamics modeling for thermal fatigue of preferred oriented copper via patterns

Scripta Materialia

Volumn 63, Issue 7, 2010, Pages 788-791

  Kim, Gyu Seok ^a   Fivel, Marc C ^a   Lee, Hyo Jong ^b   Shin, Chansun ^c   Han, Heung Nam ^d   Chang, Hyung Jun ^d   Oh, Kyu Hwan ^d  

^a UNIV GRENOBLE ALPES   (France)

^b Dong A University   (South Korea)

^c Korea Atomic Energy Research Institute   (South Korea)

^d Seoul National University   (South Korea)

Author keywords

Copper via; Dislocation dynamics; Fatigue; Finite element analysis

Indexed keywords

COPPER INTERCONNECTION; CRYSTAL PLASTICITY FINITE ELEMENT METHOD; CRYSTALLOGRAPHIC ORIENTATIONS; DISCRETE DISLOCATION DYNAMICS; DISLOCATION DYNAMICS; FATIGUE; FINITE ELEMENT ANALYSIS; INTERNAL STRESS; LONGITUDINAL DIRECTION; NUMERICAL MODELING;

COPPER; COUPLED CIRCUITS; DISLOCATIONS (CRYSTALS); DYNAMICS; THERMAL FATIGUE;

FINITE ELEMENT METHOD;

EID: 77955549920     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2010.06.018     Document Type: Article

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