In situ observation of the grain growth of the copper electrodeposits for ultralarge scale integration

Applied Physics Letters

Volumn 89, Issue 16, 2006, Pages

  Lee, Hyo Jong ^a   Han, Heung Nam ^a   Kim, Do Hyun ^a   Lee, Ui Hyoung ^a   Oh, Kyu Hwan ^a   Cha, Pil Ryung ^b  

^a Seoul National University   (South Korea)

^b Kookmin University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BACKSCATTERING; COPPER DEPOSITS; ELECTRODEPOSITION; ELECTRON DIFFRACTION; INTERFACES (MATERIALS);

COPPER ELECTRODEPOSITS; ELECTRON BACKSCATTERED DIFFRACTION TECHNIQUE; ULTRALARGE SCALE INTEGRATION;

GRAIN GROWTH;

EID: 33750173651     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2364119     Document Type: Article

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