Effects of crystallographic texture on stress-migration resistance in copper thin films

Applied Physics Letters

Volumn 81, Issue 6, 2002, Pages 1017-1019

  Koike, J ^a   Wada, M ^a   Sanada, M ^a   Maruyama, K ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AFTER-HEAT TREATMENT; AS-DEPOSITED FILMS; COPPER THIN FILM; CRYSTALLOGRAPHIC TEXTURES; CU THIN FILM; STRESS-MIGRATION; TEXTURE TRANSITION;

HEAT RESISTANCE; HEAT TREATMENT; TEXTURES; THIN FILMS;

COPPER;

EID: 79956057554     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1498495     Document Type: Article

References (23)

1. J. W. Pattern, E. D. McClanahan, and J. W. Johnson, J. Appl. Phys. 42, 4371 (1971). jap JAPIAU 0021-8979
2. S. D. Dahlgren, J. Vac. Sci. Technol. 11, 832 (1974). jvs JVSTAL 0022-5355
3. T. Ohmi, T. Saito, M. Otsuki, and T. Shibata, J. Electrochem. Soc. 138, 1089 (1991). jes JESOAN 0013-4651
4. T. Nitta, T. Ohmi, M. Otsuki, T. Takewaki, and T. Shibata, J. Electrochem. Soc. 139, 663 (1992). jes JESOAN 0013-4651
5. E. M. Zielinski, R. P. Vinci, and J. C. Bravman, J. Appl. Phys. 76, 4516 (1994). jap JAPIAU 0021-8979
6. J. E. Sanchez, Jr. and E. Arzt, Scr. Metall. 27, 285 (1992). smm SCRMEX 0956-716X
7. C. V. Thompson, Scr. Metall. 28, 167 (1993). smm SCRMEX 0956-716X
8. R. Carel, C. V. Thompson, and H. J. Frost, Acta Metall. 44, 2479 (1996). acz ACMAFD 1359-6454
9. E. M. Zielinski, Ph.D. thesis, Stanford University, 1995, pp. 60-61.
10. P. Borgesen, J. K. Lee, R. Gleixner, and C.-Y. Li, Appl. Phys. Lett. 60, 1706 (1992). apl APPLAB 0003-6951
11. J. A. Nucci, Y. Shacham-Diamond, and J. E. Sanchez, Jr., Appl. Phys. Lett. 66, 3585 (1995). apl APPLAB 0003-6951
12. J. A. Nucci, R. R. Keller, J. E. Sanchez, Jr., and Y. Shacham-Diamond, Appl. Phys. Lett. 69, 4017 (1996). apl APPLAB 0003-6951
13. R. R. Keller, J. A. Nucci, and D. P. Field, J. Electron. Mater. 26, 996 (1997). jem JECMA5 0361-5235
14. A. Sekiguchi, J. Koike, Kamiya, M. Saka, and K. Maruyama, Appl. Phys. Lett. 79, 1264 (2001). apl APPLAB 0003-6951
15. F. M. d'Heurle and P. S. Ho, in Thin Films-Interdiffusion and Reactions, edited by J. M. Poate, K. N. Tu, and J. W. Mayer (Wiley, New York, 1978), p. 243.
16. H. Toyoda, T. Kawanoue, S. Ito, M. Hasunuma, and H. Kaneko, AIP Conf. Proc. 373, 169 (1996). apc APCPCS 0094-243X
17. E. M. Zielinski, R. P. Vinci, and J. C. Bravman, Appl. Phys. Lett. 67, 1078 (1995). apl APPLAB 0003-6951
18. S. P. Baker, A. Kretschmann, and E. Arzt, Acta Mater. 49, 2145 (2001). acz ACMAFD 1359-6454
19. F. Ernst, M. W. Finnis, A. Koch, C. Schmidt, B. Straumal, and W. Gust, Z. Metallkd. 87, 911 (1996). zem ZEMTAE 0044-3093
20. D. L. Medlin, G. H. Campbell, and C. B. Carter, Acta Metall. 46, 5135 (1998). acz ACMAFD 1359-6454
21. See, for example, Landolt-Bornstein (Springer, Berlin, 1966), Group III, Vol. 1, p. 6.
22. C. B. Carter and I. L. F. Ray, Philos. Mag. 35, 189 (1977). phm PHMAA4 0031-8086
23. L. E. Murr, Interfacial phenomena in Metals and Alloys (Addison-Wesley, Reading, MA, 1975).