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Volumn 474, Issue 1-2, 2005, Pages 250-254
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Electron backscattered diffraction analysis of copper damascene interconnect for ultralarge-scale integration
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Author keywords
Anisotropy; Copper; Metallization; Nanostractures
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Indexed keywords
ANISOTROPY;
CHEMICAL MECHANICAL POLISHING;
COPPER;
CRYSTAL MICROSTRUCTURE;
CRYSTAL ORIENTATION;
ELECTRODEPOSITION;
ELECTROMAGNETIC WAVE BACKSCATTERING;
ELECTROMAGNETIC WAVE DIFFRACTION;
METALLIZING;
NANOSTRUCTURED MATERIALS;
SINGLE CRYSTALS;
ELECTRON BACKSCATTERED DIFFRACTION (EBSD);
OVER-PLATED LAYERS;
PLANE-VIEW MEASUREMENT;
TRENCH PATTERNS;
ULSI CIRCUITS;
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EID: 10844246434
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2004.08.141 Document Type: Article |
Times cited : (22)
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References (12)
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