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Volumn 2004-January, Issue January, 2004, Pages 49-60

Convergence and interaction of BEOL and BE reliability methodology

Author keywords

[No Author keywords available]

Indexed keywords

MICROELECTRONIC PROCESSING; MICROELECTRONICS;

EID: 77955557555     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2004.1315301     Document Type: Conference Paper
Times cited : (2)

References (19)
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    • (2003) International Technology Roadmap for Semiconductors
  • 4
    • 0034822653 scopus 로고    scopus 로고
    • Thermo-electromigration phenomenon of solder bump, leading to flip-chip devices with 5,000 bumps
    • Orlando/FL, USA
    • K. Nakagawa et al., "Thermo-Electromigration Phenomenon of Solder Bump, Leading to Flip-Chip devices with 5,000 Bumps," Proceedings of the 51s' Electronic Components and Technology Conference, Orlando/FL, USA, 2001, pp. 971-7
    • (2001) Proceedings of the 51s' Electronic Components and Technology Conference , pp. 971-977
    • Nakagawa, K.1
  • 9
    • 0034821489 scopus 로고    scopus 로고
    • Constitutive behaviour of lead-free solders vs. Lead-containing solders-experiments on bulk specimens and flip-chip joints
    • Orlando/FL, USA
    • S. Wiese et al., "Constitutive Behaviour of Lead-free Solders vs. Lead-containing Solders -Experiments on Bulk Specimens and Flip-Chip Joints," Proceedings of the 51'h Electronic Components and Technology Conference, Orlando/FL, USA, 2001, pp. 890-902
    • (2001) Proceedings of the 51'h Electronic Components and Technology Conference , pp. 890-902
    • Wiese, S.1
  • 11
    • 3042608961 scopus 로고    scopus 로고
    • Method 1010.7 (temperature cycling -conditions a, b, c), may 29, 1987
    • Department of Defense, USA, Dec 31, Rev, Version of Dec 18,2000
    • "Method 1010.7 (Temperature Cycling -Conditions A, B, C), May 29, 1987," Test Method Standard -Microcircuits: MIL-STD-S83E, Department of Defense, USA, Dec 31, 1996, Rev, Version of Dec 18,2000
    • (1996) Test Method Standard -Microcircuits: MIL-STD-S83E
  • 12
    • 84932150855 scopus 로고    scopus 로고
    • Automated fem mesh optimization for nonlinear problems based on error estimation
    • S. Rzepka, "Automated FEM Mesh Optimization for Nonlinear Problems Based on Error Estimation," Proceedings of Eu-roSIME 2004, Brussels, Belgium, 2004
    • (2004) Proceedings of Eu-roSIME 2004, Brussels, Belgium
    • Rzepka, S.1
  • 13
    • 84932127626 scopus 로고    scopus 로고
    • Advanced techniques
    • 6th Edition; SAS IP Inc
    • "Advanced Techniques," ANSYS Documentation, 6th Edition; SAS IP Inc., 1999
    • (1999) ANSYS Documentation
  • 16
    • 84937650904 scopus 로고
    • Electromigration - A brief survey and some recent results
    • J.R. Black, "Electromigration -A Brief Survey and Some Recent Results," IEEE Transactions on Electron Devices, vol. ED-16 (1969), pp. 338-47
    • (1969) IEEE Transactions on Electron Devices , vol.ED-16 , pp. 338-347
    • Black, J.R.1
  • 17
    • 0001163312 scopus 로고
    • A model for stress-induced metal notching and voiding in VLSI al-si(l%) metallization
    • J.W. McPherson, C.F. Dunn, "A Model for Stress-induced Metal Notching and Voiding in VLSI Al-Si(l%) Metallization," Journal of Vacuum Science and technology. Part B, vol. 5, no. 5 (1987), pp. 1321-5
    • (1987) Journal of Vacuum Science and Technology. Part B , vol.5 , Issue.5 , pp. 1321-1325
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  • 19
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    • Thermal diffusion model describing transient strain in chip solder-joints under thermal cycling
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    • G. DiGiacomo, "Thermal diffusion model describing transient strain in chip solder-joints under thermal cycling," Proceedings of the 1992 International Symposium on Microelectronics, San Francisco/CA, USA, 1992, pp. 637-42
    • (1992) Proceedings of the 1992 International Symposium on Microelectronics , pp. 637-642
    • Digiacomo, G.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.