Direct imprinting of high resolution TiO2 nanostructures

Nanotechnology

Volumn 21, Issue 28, 2010, Pages

  Lim, Su Hui ^a   Saifullah, M S M ^a   Hussain, Hazrat ^a   Loh, Wei Wei ^a   Low, Hong Yee ^a  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COST SAVING; DEMOLDING; DIRECT NANOIMPRINT; DIRECT-PATTERNING; ETHYLENE GLYCOL DIMETHACRYLATE; HIGH RESOLUTION; IMPRINTED STRUCTURES; MULTI-COMPONENT OXIDES; ORGANICS; SILICON MOLDS; SUBMICRON; TIO; VERY HIGH RESOLUTION;

ASPECT RATIO; ETHYLENE; ETHYLENE GLYCOL; FREE RADICALS; MOLDS; NANOSTRUCTURES; POLYMERS; RESINS; TITANIUM;

FREE RADICAL POLYMERIZATION;

EID: 77954152010     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/21/28/285303     Document Type: Article

References (32)

1. O'Regan B and Grätzel M 1991 Nature 353 737-40
2. Barbé C J, Arendse F, Comte P, Jirousek M, Lenzmann F, Shklover V and Grätzel M 1997 J. Am. Ceram. Soc. 80 3157-71
3. Yoshida M and Prasad P N 1996 Chem. Mater. 8 235-41
4. Que W, Zhou Y, Lam Y L and Kam C H 2001 Appl. Phys. A 73 171-6
5. Que W and Kam C H 2002 Opt. Eng. 41 1733-7
6. Arakawa S, Mogi K, Kikuta K, Yogo T and Hirano S 1999 J. Am. Ceram. Soc. 82 225-8
7. Ohzuku T and Hirai T 1982 Electrochim. Acta 27 1263-6
8. Livage J 1986 Mater. Res. Soc. Symp. Proc. 73 717-24
9. Kalbacova M, Macak J M, Schmidt-Stein F, Mierke C T and Schmuki P 2008 Phys. Status Solidi (RRL) 2 194-6
10. Peng L, Barczak A J, Barbeau R A, Xiao Y, LaTempa T J, Grimes C A and Desai T A 2010 Nano Lett. 10 143-8
11. Zhang M, Bando Y and Wada K 2001 J. Mater. Sci. Lett. 20 167-70
12. Chen X, Schriver M, Suen T and Mao S S 2007 Thin Solid Films 515 8511-4
13. Albu S P, Ghicov A, Macak J M, Hahn R and Schmuki P 2007 Nano Lett. 7 1286-9
14. Rao A R and Dutta V 2007 Sol. Energy Mater. Sol. Cells 91 1075-80
15. Saifullah M S M, Subramanian K R V, Tapley E, Kang D J, Welland M E and Butler M 2003 Nano Lett. 3 1587-91
16. Voicu N E, Saifullah M S M, Subramanian K R V, Welland M E and Steiner U 2007 Soft Matter 3 554-7
17. Passinger S, Saifullah M S M, Reinhardt C, Subramanian K R V, Chichkov B N and Welland M E 2007 Adv. Mater. 19 1218-21
18. Duoss E B, Twardowski M and Lewis J A 2007 Adv. Mater. 19 3485-9
19. Schrift H 2008 J. Vac. Sci. Technol. B 26 458-80
20. Guo L J 2007 Adv. Mater. 19 495-513
21. Li M, Tan H, Chen L, Wan J and Chou S Y 2003 J. Vac. Sci. Technol. B 21 660-3
22. Matsui S, Igaku Y, Ishigaki H, Fujita J, Ishida M, Ochiai Y, Namatsu H and Komuro M 2003 J. Vac. Sci. Technol. B 21 688-92
23. Kim W S, Yoon K B and Bae B S 2005 J. Mater. Chem. 15 4535-9
24. Göbel O F, Nedelcu M and Steiner U 2007 Adv. Funct. Mater. 17 1131-6
25. Kwon S J, Park J H and Park J G 2006 J. Electroceram. 17 455-9
26. Hampton M J, Williams S S, Zhou Z, Nunes J, Ko D H, Templeton J L, Samulski E T and DeSimone J M 2008 Adv. Mater. 20 2667-73
27. Yang K-Y, Yoon K-M, Choi K W and Lee H 2009 Microelectron. Eng. 86 2228-31
28. Yang K-Y, Yoon K-M, Lim S and Lee H 2009 J. Vac. Sci. Technol. B 27 2786-9
29. Yoon K-M, Yang K-Y, Lee H and Kim H-S 2009 J. Vac. Sci. Technol. B 27 2810-3
30. Kang Y, Okada M, Nakamatsu K-I, Kanda K, Haruyama Y and Matsui S 2009 J. Vac. Sci. Technol. B 27 2805-9
31. Gotoh Y, Imakita J, Ohkoshi Y and Nagura M 2000 Polym. J. 32 838-44
32. Sayilkan H, Şener Ş., Şener E and Arpaç E 1999 J. Mater. Sci. 34 5325-30