On the chemo-mechanical polishing (CMP) of Si3N4 bearing balls with water based CeO2 slurry

Journal of Engineering Materials and Technology, Transactions of the ASME

Volumn 120, Issue 4, 1998, Pages 304-312

  Jiang, Ming ^a   Wood, Nelson O ^b   Komanduri, R ^a  

^a OKLAHOMA STATE UNIVERSITY   (United States)

^b TASC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; BEARINGS (MACHINE PARTS); CERAMIC PRODUCTS; CERIUM COMPOUNDS; CHEMICAL POLISHING; GIBBS FREE ENERGY; HYDROLYSIS; INTERFACES (MATERIALS); SILICA; SUBSTRATES;

CERIUM OXIDE; CHEMOMECHANICAL POLISHING (CMP);

SILICON NITRIDE;

EID: 0032179456     PISSN: 00944289     EISSN: 15288889     Source Type: Journal    
DOI: 10.1115/1.2807019     Document Type: Article

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