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Applied Physics Letters

Volumn 81, Issue 10, 2002, Pages 1875-1877

Simulation of chemical mechanical planarization of copper with molecular dynamics

(4) Ye, Y a,b Biswas, R a Bastawros, A a Chandra, A c

a IOWA STATE UNIVERSITY (United States)

b WUHAN UNIVERSITY (China)

c Iowa State University of Science and Technology (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVE PARTICLES; CHEMICAL DISSOLUTION; CHEMICAL-MECHANICAL PLANARIZATION; COPPER INTERCONNECTS; COPPER SURFACE; EMBEDDED-ATOM METHOD; FRICTIONAL FORCES; LARGE CHIPS; MECHANICAL ABRASION; NANO SCALE;

ABRASION; COPPER; DISLOCATIONS (CRYSTALS); DISSOLUTION; DYNAMICS; MECHANISMS; MOLECULAR DYNAMICS; SURFACES;

CHEMICAL MECHANICAL POLISHING;

EID: 79956022354 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.1505113 Document Type: Article

Times cited : (29)

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