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Volumn 42, Issue 4 B, 2003, Pages 1897-1902
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Quantum chemical molecular dynamics studies on the chemical mechanical polishing process of Cu surface
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Author keywords
Accelerated quantum chemical molecular dynamics simulation; Chemical mechanical polishing; Computational chemistry; Cu; Surface reaction; Tight binding theory
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Indexed keywords
CHEMICAL MECHANICAL POLISHING;
COMPUTER SIMULATION;
HYDROGEN PEROXIDE;
MOLECULAR DYNAMICS;
OXIDATION;
PH EFFECTS;
QUANTUM THEORY;
SOLUTIONS;
SUBSTRATES;
SURFACE CHEMISTRY;
QUANTUM CHEMICAL MOLECULAR DYNAMICS;
TIGHT-BINDING THEORY;
COPPER;
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EID: 0037672159
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.42.1897 Document Type: Article |
Times cited : (21)
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References (31)
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