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Volumn 253, Issue 14, 2007, Pages 6211-6216

Study micromechanism of surface planarization in the polishing technology using numerical simulation method

Author keywords

Chemical mechanical polishing; Dislocation; Molecular dynamics; Silicon wafer; Vacancy

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COMPUTER SIMULATION; MOLECULAR DYNAMICS; PLASTIC DEFORMATION; RESIDUAL STRESSES; SILICON WAFERS; SLURRIES; SURFACE PROPERTIES;

EID: 34247112336     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2007.01.115     Document Type: Article
Times cited : (39)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.