Initial Cu growth in Cu-seeded and Ru-lined narrow trenches for supercritical fluid Cu chemical deposition

Japanese Journal of Applied Physics

Volumn 49, Issue 5 PART 3, 2010, Pages

  Kondoh, Eiichi ^a   Matsubara, Masahiro ^a   Tamai, Kakeru ^a   Shimogaki, Yukihiro ^a,b  

^a UNIVERSITY OF YAMANASHI   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL DEPOSITION; CU FILMS; ELEVATED TEMPERATURE; GRAIN COARSENING; MORPHOLOGICAL STABILITY; SEED LAYER; SUPERCRITICAL CO;

AGGLOMERATION; CHEMICAL STABILITY; EFFLUENT TREATMENT; SUPERCRITICAL FLUIDS;

COPPER;

EID: 77953171606     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.49.05FA07     Document Type: Article

References (20)

1. R. Span and W. Wagner: J. Phys. Chem. Ref. Data 25 (1996) 1509.
2. E. Kondoh and H. Kato: Microelectron. Eng. 64 (2002) 495.
3. A. Cabañas, J. M. Blackburn, and J. J. Watkins: Microelectron. Eng. 64 (2002) 53.
4. T. Momose, M. Sugiyama, E. Kondoh, and Y. Shimogaki: Appl. Phys. Express 1 (2008)097002.
5. X.-R. Ye, Y. Lin, C. Wang, and C. M. Wai: Adv. Mater. 15 (2003) 316.
6. E. Kondoh: Proc. IEEE Int. Interconnect Technology Conf., 2004, p. 33.
7. E. Kondoh: Jpn. J. Appl. Phys. 43 (2004) 3928.
8. E. Kondoh: Jpn. J. Appl. Phys. 44 (2005) 5799.
9. A. O'Neil and J. J. Watkins: Chem. Mater. 18 (2006) 5652.
10. E. Kondoh and K. Shigama: Thin Solid Films 491 (2005) 228.
11. E. Kondoh and J. Fukuda: J. Supercrit. Fluids 44 (2008) 466.
12. M. Matsubara, M. Hirose, K. Tamai, Y. Shimogaki, and E. Kondoh: J. Electrochem. Soc. 156 (2009) H443.
13. M. Matsubara and E. Kondoh: Hyomen Gijutsu 60 (2009) 533 [in Japanese].
14. O.-K. Kwon, J.-H. Kim, H.-S. Park, and S.-W. Kang: J. Electrochem. Soc. 151 (2004) G109.
15. M. Abe, M. Ueki, M. Tada, T. Onodera, N. Furutake, K. Shimura, S. Saito, and Y. Hayashi: Proc. IEEE Int. Interconnect Technology Conf., 2007, p. 4.
16. H. Kim and Y. Shimogaki: J. Electrochem. Soc. 154 (2007) G13.
17. C.-Y. Yang and J. S. Chen: J. Electrochem. Soc. 150 (2003) G826.
18. T. Hara, K. Sakata, A. Kawaguchi, and S. Kamijima: Electrochem. Solid-State Lett. 4 (2001) C81.
19. K. Hoshino, T. Momose, and Y. Shimogaki: Ext. Abstr. (55th Spring Meet., 2008); Japan Society of Applied Physics and Related Societies, p. 876 [in Japanese].
20. R. M. German: Powder Metallurgy Science (Metal Powder Industries Federation, Princeton, NJ, 1994).