Process variation and temperature-aware reliability management

Proceedings -Design, Automation and Test in Europe, DATE

Volumn , Issue , 2010, Pages 580-585

  Zhuo, Cheng ^a   Sylvester, Dennis ^a   Blaauw, David ^a  

^a University of Michigan   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE ERRORS; DYNAMIC RELIABILITY MANAGEMENTS; FREQUENCY-SCALING; IN-PROCESS; KEY ISSUES; LOCAL VARIATIONS; MONTE CARLO SIMULATION; ON CHIPS; ORDERS OF MAGNITUDE; OXIDE BREAKDOWN; PERFORMANCE IMPROVEMENTS; PROCESS VARIATION; PROCESSOR PERFORMANCE; RELIABILITY ESTIMATION; RELIABILITY MANAGEMENT; RELIABILITY MARGIN; SCALED TECHNOLOGIES; SIMPLIFYING ASSUMPTIONS; SPATIAL AND TEMPORAL VARIATION; SYSTEM RELIABILITY; TEMPERATURE PARAMETERS; WORKLOAD VARIATION;

COMPUTER SIMULATION; FREQUENCY ESTIMATION; MICROPROCESSOR CHIPS; MONTE CARLO METHODS; NANOTECHNOLOGY;

RELIABILITY;

EID: 77953104217     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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