Reliability modeling and management in dynamic microprocessor-based systems

Proceedings - Design Automation Conference

Volumn , Issue , 2006, Pages 1057-1060

  Karl, Eric ^a   Blaauw, David ^a   Sylvester, Dennis ^a   Mudge, Trevor ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Dynamic reliability management; Electromigration; Modeling; Oxide breakdown; Thermal cycling

Indexed keywords

DIELECTRIC PROPERTIES; ELECTRIC BREAKDOWN; ELECTRIC POTENTIAL; ELECTROMIGRATION; RELIABILITY ANALYSIS; THERMAL CYCLING;

DYNAMIC RELIABILITY MANAGEMENT; OXIDE BREAKDOWN; PROCESSOR DESIGN; REAL TIME RELIABILITY;

MICROPROCESSOR CHIPS;

EID: 34547166614     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1146909.1147174     Document Type: Conference Paper

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