New surface treatment and microscale/nanoscale surface patterning using electrostatically clamped stencil mask

Japanese Journal of Applied Physics

Volumn 48, Issue 9 Part 1, 2009, Pages 0950071-0950076

  Couderc, Sandrine ^a   Blech, Vincent ^a   Kim, Beomjoon ^a  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRO-STATIC CLAMPING; ELECTRON PROJECTION LITHOGRAPHY; LOCAL DEPOSITION; METAL MATERIALS; MICRO-SCALES; NANO-SCALE APERTURE; ORGANIC LIGHT-EMITTING DEVICES; PLASMA PROCESS; SILICON MEMBRANES; SILICON ON INSULATOR WAFERS; STENCIL LITHOGRAPHY; STENCIL MASKS; SURFACE PATTERNING;

FIELD EFFECT TRANSISTORS; ORGANIC FIELD EFFECT TRANSISTORS; PHOTOLITHOGRAPHY; REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SUBSTRATES;

SURFACE TREATMENT;

EID: 77952710498     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.48.095007     Document Type: Article

References (26)

1. K. B. Lee, S. J. Park, C. A. Mirkin, C. J. Smith, and M. Milan: Science 295 (2002) 1702.
2. J. L. Wilbur, A. Kumar, E. Kim, and G. M. Whitesides: Adv. Mater. 6 (1994) 600.
3. P. Belaubre, M. Guirardel, G. Garcia, J. B. Pourciel, V. Leberre, A. Dagkessamanskaia, E. Trevisiol, J. M. Francois, and C. Bergaud: Appl. Phys. Lett. 82 (2003) 3122.
4. M. Li, L. Chen, and S. Chou: Appl. Phys. Lett. 78 (2001) 3322.
5. H. Sugimura and N. Nakagiri: J. Vac. Sci. Technol. A 14 (1996) 1223.
6. M. M. Deshmukh, D. C. Ralph, M. Thomas, and J. Silcox: Appl. Phys. Lett. 75 (1999) 1631.
7. P. Calvert: Chem. Mater. 13 (2001) 3299.
8. V. Blech, N. Takama, and B. J. Kim: J. Vac. Sci. Technol. B 24 (2006) 55.
9. M. Apaniusb, P. B. Kaula, and A. R. Abramson: Sens. Actuators A 140 (2007) 168.
10. J. Brugger, J. W. Berenschot, S. Kuiper, W. Nijdam, B. Otter, and M. Elwenspoek: Microelectron. Eng. 53 (2000) 403.
11. J. Köhler, M. Albrecht, C. R. Musil, and E. Bucher: Physica E 4 (1999) 196.
12. A. Tourovskaia, T. Barber, B. T. Wickes, D. Hirdes, B. Grin, D. G. Castner, K. E. Healy, and A. Folch: Langmuir 19 (2003) 4754.
13. A. Folch, B. H. Jo, O. Hurtado, D. J. Beebe, and M. Toner: J. Biomed. Mater. Res., Part A 52 (2000) 346.
14. H. Mekaru, T. Takano, Y. Ukita, Y. Utsumi, and M. Takahashi: Microsyst. Technol. 14 (2008) 1335.
15. A. R. Champagne, A. J. Couture, F. Kuemmeth, and D. C. Ralph: Appl. Phys. Lett. 82 (2003) 1111.
16. B. Ghyselen, J. M. Hartmann, T. Ernst, C. Aulnette, B. Osternaud, Y. Bogumilowicz, A. Abbadie, P. Besson, O. Rayssac, A. Tiberj, N. Daval, I. Cayrefourq, F. Fournel, H. Moriceau, C. Di Nardo, F. Andrieu, V. Paillard, M. Cabié, L. Vincent, E. Snoeck, F. Cristiano, A. Rocher, A. Ponchet, A. Claverie, P. Boucaud, M. N. Semeria, D. Bensahel, N. Kernevez, and C. Mazure: Solid-State Electron. 48 (2004) 1285.
17. W. R. Thurber, R. L. Mattis, and Y. M. Liu: J. Electrochem. Soc. 127 (1980) 2291.
18. G. M. Rebeiz: RF MEMS Theory, Design and Technology (Wiley, New York, 2003) p. 34.
19. Z. Linlin, X. Chen, Y. Daohong, H. Wenxiao, and Z. Hu: J. Funct. Mater. Devices 3 (2005) 373.
20. T. Bourouina, C. Vauge, and H. Mekki: Sens. Actuators A 49 (1995) 21.
21. T. N. Tun, M. H. Thu Lwin, H. H. Kim, N. Chandrasekhar, and C. Joachim: Nanotechnology 18 (2007) 335301.
22. O. Vázquez-Mena, G. Villanueva, M. A. F. van den Boogaart, V. Savu, and J. Brugger: Microelectron. Eng. 85 (2008) 1237.
23. M. Kölbel, R. W. Tjerkstra, G. Kim, J. Brugger, C. J. M. van Rijn, W. Nijdam, J. Huskens, and D. N. Reinhoudt: Nano Lett. 2 (2002) 1339.
24. N. Takano, L. M. Doeswijk, M. A. F. van den Boogaart, J. Auerswald, H. F. Knapp, O. Dubochet, T. Hessler, and J. Brugger: J. Micromech. Microeng. 16 (2006) 1606.
25. P. F. Baude, D. A. Ender, M. A. Haase, T. W. Kelley, D. V. Muyres, and S. D. Theiss: Appl. Phys. Lett. 82 (2003) 3964.
26. S. Bhattacharya, A. Datta, J. M. Berg, and S. Gangopadhyay: J. Microeletromech. Syst. 14 (2005) 590.