-
1
-
-
33646922057
-
The future of wires
-
R. Ho, K. W. Mai, and M. A. Horowitz, "The future of wires," Proc. IEEE, vol. 89, pp. 490-504, 2001.
-
(2001)
Proc. IEEE
, vol.89
, pp. 490-504
-
-
Ho, R.1
Mai, K.W.2
Horowitz, M.A.3
-
4
-
-
33750366018
-
Multiscale free-space optical interconnects for intrachip global communication: Motivation, analysis, and experimental validation
-
Sept.
-
M. J. McFadden, M. Iqbal, T. Dillon, R. Nair, T. Gu, D. W. Prather, and M. W. Haney, "Multiscale free-space optical interconnects for intrachip global communication: Motivation, analysis, and experimental validation," Appl. Opt., vol. 45, no. 25, pp. 6358-6366, Sept. 2006.
-
(2006)
Appl. Opt.
, vol.45
, Issue.25
, pp. 6358-6366
-
-
McFadden, M.J.1
Iqbal, M.2
Dillon, T.3
Nair, R.4
Gu, T.5
Prather, D.W.6
Haney, M.W.7
-
5
-
-
4544274265
-
Intrachip global interconnects and the saturation of Moore's law
-
M. Iqbal, M. J. McFadden, and M. W. Haney, "Intrachip global interconnects and the saturation of Moore's law," Proc. IEEE-LEOS Summer Topical: Optical Interconnects and VLSI Photonics, San Diego, CA, Jul. 2004.
-
Proc. IEEE-LEOS Summer Topical: Optical Interconnects and VLSI Photonics, San Diego, CA, Jul. 2004
-
-
Iqbal, M.1
McFadden, M.J.2
Haney, M.W.3
-
6
-
-
54749126857
-
Nanoelectronic and nanophotonic interconnect
-
R. G. Beausoleil, P. J. Kuekes, G. S. Snider, S.-Y. Wang, and R. S. Williams, "Nanoelectronic and nanophotonic interconnect," Proc. IEEE, vol. 96, pp. 230-247, 2008.
-
(2008)
Proc. IEEE
, vol.96
, pp. 230-247
-
-
Beausoleil, R.G.1
Kuekes, P.J.2
Snider, G.S.3
Wang, S.-Y.4
Williams, R.S.5
-
8
-
-
0000894702
-
Rationale and challenges for optical interconnects to electronic chips
-
Jun.
-
D. A. B. Miller, "Rationale and challenges for optical interconnects to electronic chips," Proc. IEEE, vol. 88, no. 6, pp. 728-749, Jun. 2000.
-
(2000)
Proc. IEEE
, vol.88
, Issue.6
, pp. 728-749
-
-
Miller, D.A.B.1
-
9
-
-
0000713479
-
Performance scaling comparison for free-space optical and electrical interconnection approaches
-
M. W. Haney and M. P. Christensen, "Performance scaling comparison for free-space optical and electrical interconnection approaches," Appl. Opt., vol. 37, pp. 2886-2894, 1998.
-
(1998)
Appl. Opt.
, vol.37
, pp. 2886-2894
-
-
Haney, M.W.1
Christensen, M.P.2
-
10
-
-
12144291480
-
Description and evaluation of the fast-net smart pixel-based optical interconnection prototype
-
M. W. Haney, M. P. Christensen, P. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Ekman, P. Chandramani, and F. Kiamilev, "Description and evaluation of the fast-net smart pixel-based optical interconnection prototype," Proc. IEEE, vol. 88, pp. 819-828, 2000.
-
(2000)
Proc. IEEE
, vol.88
, pp. 819-828
-
-
Haney, M.W.1
Christensen, M.P.2
Milojkovic, P.3
Fokken, G.J.4
Vickberg, M.5
Gilbert, B.K.6
Rieve, J.7
Ekman, J.8
Chandramani, P.9
Kiamilev, F.10
-
11
-
-
0242661476
-
Multiscale optical design for global chip-to-chip optical interconnections and misalignment tolerant packaging
-
M. P. Christensen, P. Milojkovic, M. J. McFadden, and M. W. Haney, "Multiscale optical design for global chip-to-chip optical interconnections and misalignment tolerant packaging," IEEE J. Sel. Topics Quantum Electron., vol. 9, pp. 548-556, 2003.
-
(2003)
IEEE J. Sel. Topics Quantum Electron.
, vol.9
, pp. 548-556
-
-
Christensen, M.P.1
Milojkovic, P.2
McFadden, M.J.3
Haney, M.W.4
-
12
-
-
39049116444
-
Coupling structure for intrachip optical global communication: Design and simulation
-
R. Nair, M. Iqbal, T. Gu, and M. W. Haney, "Coupling structure for intrachip optical global communication: Design and simulation," Proc. IEEE LEOS Annual Meet., Montreal, Canada, Oct. 2006, pp. 815-816.
-
Proc. IEEE LEOS Annual Meet., Montreal, Canada, Oct. 2006
, pp. 815-816
-
-
Nair, R.1
Iqbal, M.2
Gu, T.3
Haney, M.W.4
-
13
-
-
63649093867
-
Prismatic coupling structure for intrachip global communication
-
Apr.
-
T. Gu, R. Nair, and M. W. Haney, "Prismatic coupling structure for intrachip global communication," IEEE J. Quantum Electron., vol. 45, no. 4, pp. 388-395, Apr. 2009.
-
(2009)
IEEE J. Quantum Electron.
, vol.45
, Issue.4
, pp. 388-395
-
-
Gu, T.1
Nair, R.2
Haney, M.W.3
-
14
-
-
66749084412
-
160 Gb/s bidirectional polymer-waveguide board-level optical interconnects using CMOS-based transceivers
-
May
-
F. E. Doany, C. L. Schow, C. W. Baks, D. M. Kuchta, P. Pepeljugoski, L. Schares, R. Budd, F. Libsch, R. Dangel, F. Horst, B. J. Offrein, and J. A. Kash, "160 Gb/s bidirectional polymer-waveguide board-level optical interconnects using CMOS-based transceivers," IEEE Trans. Adv. Pkg., vol. 32, no. 2, pp. 345-359, May 2009.
-
(2009)
IEEE Trans. Adv. Pkg.
, vol.32
, Issue.2
, pp. 345-359
-
-
Doany, F.E.1
Schow, C.L.2
Baks, C.W.3
Kuchta, D.M.4
Pepeljugoski, P.5
Schares, L.6
Budd, R.7
Libsch, F.8
Dangel, R.9
Horst, F.10
Offrein, B.J.11
Kash, J.A.12
-
15
-
-
51849124672
-
Optical proximity communication using reflective mirrors
-
Sep.
-
X. Zheng, J. E. Cunningham, I. Shubin, J. Simons, M. Asghari, D. Feng, H. Lei, D. Zheng, H. Liang, C.-C. Kung, J. Luff, T. Sze, D. Cohen, and A. V. Krishnamoorthy, "Optical proximity communication using reflective mirrors," Opt. Exp., vol. 16, no. 19, pp. 15 052-15 058, Sep. 2008.
-
(2008)
Opt. Exp.
, vol.16
, Issue.19
, pp. 15052-15058
-
-
Zheng, X.1
Cunningham, J.E.2
Shubin, I.3
Simons, J.4
Asghari, M.5
Feng, D.6
Lei, H.7
Zheng, D.8
Liang, H.9
Kung, C.-C.10
Luff, J.11
Sze, T.12
Cohen, D.13
Krishnamoorthy, A.V.14
-
16
-
-
67449128189
-
Device Requirements for Optical Interconnects to Silicon Chips
-
D. A. B. Miller, "Device Requirements for Optical Interconnects to Silicon Chips," Proc. IEEE, vol. 97, pp. 1166-1185, 2009.
-
(2009)
Proc. IEEE
, vol.97
, pp. 1166-1185
-
-
Miller, D.A.B.1
-
17
-
-
0037010143
-
Polymer-based optical waveguides: Materials, processing, and devices
-
DOI 10.1002/1521-4095(20021002)14:19<1339::AID-ADMA1339>3.0.CO;2-O
-
H. Ma, A. K. Y. Jen, and L. R. Dalton, "Polymer-based optical waveguides: Materials, processing and devices," Adv. Mater., vol. 14, pp. 1339-1365, 2002. (Pubitemid 35262797)
-
(2002)
Advanced Materials
, vol.14
, Issue.19
, pp. 1339-1365
-
-
Ma, H.1
Jen, A.K.-Y.2
Dalton, L.R.3
-
18
-
-
0033889511
-
Advances in polymer integrated optics
-
Jan./Feb.
-
L. Eldada and L. W. Shacklette, "Advances in polymer integrated optics," IEEE J. Sel. Topics Quantum Electron., vol. 6, no. 1, pp. 54-68, Jan./Feb. 2000.
-
(2000)
IEEE J. Sel. Topics Quantum Electron.
, vol.6
, Issue.1
, pp. 54-68
-
-
Eldada, L.1
Shacklette, L.W.2
-
19
-
-
0035532368
-
InP/InGaAsP multiple quantum well multimode interference coupler
-
Mar.
-
S. I. Shim, K. T. Kim, K. M. Kim, H. D. Kim, S. E. Kim, H. T. Kim, and J. H. Park, "InP/InGaAsP multiple quantum well multimode interference coupler," J. Kor. Phys. Soci., vol. 38, no. 3, Mar. 2001.
-
(2001)
J. Kor. Phys. Soci.
, vol.38
, Issue.3
-
-
Shim, S.I.1
Kim, K.T.2
Kim, K.M.3
Kim, H.D.4
Kim, S.E.5
Kim, H.T.6
Park, J.H.7
-
20
-
-
4444353853
-
A surface-normal coupled-quantum-well modulator at 1.55μm
-
Sep.
-
T. H. Stievater, W. S. Rabinovich, P. G. Goetz, R. Mahon, and S. C. Binari, "A surface-normal coupled-quantum-well modulator at 1.55μm," IEEE Photon. Technol. Lett., vol. 16, no. 9, pp. 2036-2038, Sep. 2004.
-
(2004)
IEEE Photon. Technol. Lett.
, vol.16
, Issue.9
, pp. 2036-2038
-
-
Stievater, T.H.1
Rabinovich, W.S.2
Goetz, P.G.3
Mahon, R.4
Binari, S.C.5
-
21
-
-
0029327780
-
Digital free-space optical interconnections: A comparison of transmitter technologies
-
Jun.
-
C. Fan, et al., "Digital free-space optical interconnections: a comparison of transmitter technologies," Appl. Opt., vol. 34, no. 17, pp. 3103-3115, Jun. 1995.
-
(1995)
Appl. Opt.
, vol.34
, Issue.17
, pp. 3103-3115
-
-
Fan, C.1
-
22
-
-
0029290641
-
GaAs MQW modulators integrated with Silicon CMOS
-
Apr.
-
K. W. Goossen, et al., "GaAs MQW modulators integrated with Silicon CMOS", IEEE Photon. Technol. Lett., vol. 7, no. 4, Apr., 1995.
-
(1995)
IEEE Photon. Technol. Lett.
, vol.7
, Issue.4
-
-
Goossen, K.W.1
-
23
-
-
39749159619
-
1550nm optical interconnect transceiver with low voltage electroabsorption modulators flip-chip bonded to 90nm CMOS
-
J. E. Roth, et al., "1550nm optical interconnect transceiver with low voltage electroabsorption modulators flip-chip bonded to 90nm CMOS," Proc. Opt. Fiber Commun. Nat. Fiber Optic Engineers Conf., Mar. 2007.
-
Proc. Opt. Fiber Commun. Nat. Fiber Optic Engineers Conf., Mar. 2007
-
-
Roth, J.E.1
-
24
-
-
0031153807
-
Wafer fusion: Materials issues and device results
-
Jun.
-
A. Black, et al., "Wafer fusion: materials issues and device results," IEEE J. Sel. Topics Quantum Electron., vol. 3, no. 3, pp. 943-951, Jun. 1997.
-
(1997)
IEEE J. Sel. Topics Quantum Electron.
, vol.3
, Issue.3
, pp. 943-951
-
-
Black, A.1
-
25
-
-
79956012595
-
Interface of directly bonded InP wafers for vertical couplers
-
Feb.
-
N. Y. Jin-Phillipp, et al., "Interface of directly bonded InP wafers for vertical couplers," Appl. Phys. Lett., vol. 80, no. 8, Feb. 2002.
-
(2002)
Appl. Phys. Lett.
, vol.80
, Issue.8
-
-
Jin-Phillipp, N.Y.1
-
26
-
-
13244265614
-
Continuous-tone grayscale mask fabrication using high-energy-beam- sensitive glass
-
T. Dillon et al., "Continuous-tone grayscale mask fabrication using high-energy-beam-sensitive glass," SPIE J. Microlithogr., Microfabrication Microsyst., vol. 3, 2004.
-
(2004)
SPIE J. Microlithogr., Microfabrication Microsyst.
, vol.3
-
-
Dillon, T.1
-
27
-
-
28344443542
-
45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects,"
-
L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. Chen, "45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects," Appl. Phys. Lett., 87, 141110, 2005.
-
(2005)
Appl. Phys. Lett.
, vol.87
, pp. 141110
-
-
Wang, L.1
Wang, X.2
Jiang, W.3
Choi, J.4
Bi, H.5
Chen, R.6
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