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Volumn 7607, Issue , 2010, Pages

Modulation-enabled tapered remote coupler: All-optical communication on and off chip

Author keywords

Global interconnects; Multiple quantum well (MQW) modulator; Optical interconnect; Optoelectronics

Indexed keywords

ALL-OPTICAL COMMUNICATION; BANDWIDTH REQUIREMENT; CHIP-SCALE; CMOS DEVICES; COMPUTING POWER; COUPLING STRUCTURES; CRITICAL DIMENSION; DIRECT COUPLING; ELECTRICAL INTERCONNECTS; FABRICATION PROCESS; FREE SPACE; GLOBAL INTERCONNECTS; HIGH BANDWIDTH; MANUFACTURING PROCESS; MODERN MICROPROCESSOR; MOORE'S LAW; MULTICORE CHIPS; MULTIPLE QUANTUM WELL MODULATORS; MULTIPLE QUANTUM WELLS; OFF-CHIP; OFF-CHIP COMMUNICATION; ON CHIPS; OPTICAL INTERCONNECT; OPTICAL MODULATORS; OPTICAL SOLUTIONS; OPTO-ELECTRONICS; OPTOELECTRONIC COMPONENTS; POTENTIAL SOLUTIONS; POWER BUDGETS; PRISMATIC STRUCTURES; REMOTE REGIONS; SILICON CMOS; SILICON DIE; TWO DOMAINS;

EID: 77951778912     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.845996     Document Type: Conference Paper
Times cited : (3)

References (27)
  • 1
    • 33646922057 scopus 로고    scopus 로고
    • The future of wires
    • R. Ho, K. W. Mai, and M. A. Horowitz, "The future of wires," Proc. IEEE, vol. 89, pp. 490-504, 2001.
    • (2001) Proc. IEEE , vol.89 , pp. 490-504
    • Ho, R.1    Mai, K.W.2    Horowitz, M.A.3
  • 4
    • 33750366018 scopus 로고    scopus 로고
    • Multiscale free-space optical interconnects for intrachip global communication: Motivation, analysis, and experimental validation
    • Sept.
    • M. J. McFadden, M. Iqbal, T. Dillon, R. Nair, T. Gu, D. W. Prather, and M. W. Haney, "Multiscale free-space optical interconnects for intrachip global communication: Motivation, analysis, and experimental validation," Appl. Opt., vol. 45, no. 25, pp. 6358-6366, Sept. 2006.
    • (2006) Appl. Opt. , vol.45 , Issue.25 , pp. 6358-6366
    • McFadden, M.J.1    Iqbal, M.2    Dillon, T.3    Nair, R.4    Gu, T.5    Prather, D.W.6    Haney, M.W.7
  • 8
    • 0000894702 scopus 로고    scopus 로고
    • Rationale and challenges for optical interconnects to electronic chips
    • Jun.
    • D. A. B. Miller, "Rationale and challenges for optical interconnects to electronic chips," Proc. IEEE, vol. 88, no. 6, pp. 728-749, Jun. 2000.
    • (2000) Proc. IEEE , vol.88 , Issue.6 , pp. 728-749
    • Miller, D.A.B.1
  • 9
    • 0000713479 scopus 로고    scopus 로고
    • Performance scaling comparison for free-space optical and electrical interconnection approaches
    • M. W. Haney and M. P. Christensen, "Performance scaling comparison for free-space optical and electrical interconnection approaches," Appl. Opt., vol. 37, pp. 2886-2894, 1998.
    • (1998) Appl. Opt. , vol.37 , pp. 2886-2894
    • Haney, M.W.1    Christensen, M.P.2
  • 11
    • 0242661476 scopus 로고    scopus 로고
    • Multiscale optical design for global chip-to-chip optical interconnections and misalignment tolerant packaging
    • M. P. Christensen, P. Milojkovic, M. J. McFadden, and M. W. Haney, "Multiscale optical design for global chip-to-chip optical interconnections and misalignment tolerant packaging," IEEE J. Sel. Topics Quantum Electron., vol. 9, pp. 548-556, 2003.
    • (2003) IEEE J. Sel. Topics Quantum Electron. , vol.9 , pp. 548-556
    • Christensen, M.P.1    Milojkovic, P.2    McFadden, M.J.3    Haney, M.W.4
  • 13
    • 63649093867 scopus 로고    scopus 로고
    • Prismatic coupling structure for intrachip global communication
    • Apr.
    • T. Gu, R. Nair, and M. W. Haney, "Prismatic coupling structure for intrachip global communication," IEEE J. Quantum Electron., vol. 45, no. 4, pp. 388-395, Apr. 2009.
    • (2009) IEEE J. Quantum Electron. , vol.45 , Issue.4 , pp. 388-395
    • Gu, T.1    Nair, R.2    Haney, M.W.3
  • 16
    • 67449128189 scopus 로고    scopus 로고
    • Device Requirements for Optical Interconnects to Silicon Chips
    • D. A. B. Miller, "Device Requirements for Optical Interconnects to Silicon Chips," Proc. IEEE, vol. 97, pp. 1166-1185, 2009.
    • (2009) Proc. IEEE , vol.97 , pp. 1166-1185
    • Miller, D.A.B.1
  • 17
    • 0037010143 scopus 로고    scopus 로고
    • Polymer-based optical waveguides: Materials, processing, and devices
    • DOI 10.1002/1521-4095(20021002)14:19<1339::AID-ADMA1339>3.0.CO;2-O
    • H. Ma, A. K. Y. Jen, and L. R. Dalton, "Polymer-based optical waveguides: Materials, processing and devices," Adv. Mater., vol. 14, pp. 1339-1365, 2002. (Pubitemid 35262797)
    • (2002) Advanced Materials , vol.14 , Issue.19 , pp. 1339-1365
    • Ma, H.1    Jen, A.K.-Y.2    Dalton, L.R.3
  • 21
    • 0029327780 scopus 로고
    • Digital free-space optical interconnections: A comparison of transmitter technologies
    • Jun.
    • C. Fan, et al., "Digital free-space optical interconnections: a comparison of transmitter technologies," Appl. Opt., vol. 34, no. 17, pp. 3103-3115, Jun. 1995.
    • (1995) Appl. Opt. , vol.34 , Issue.17 , pp. 3103-3115
    • Fan, C.1
  • 22
    • 0029290641 scopus 로고
    • GaAs MQW modulators integrated with Silicon CMOS
    • Apr.
    • K. W. Goossen, et al., "GaAs MQW modulators integrated with Silicon CMOS", IEEE Photon. Technol. Lett., vol. 7, no. 4, Apr., 1995.
    • (1995) IEEE Photon. Technol. Lett. , vol.7 , Issue.4
    • Goossen, K.W.1
  • 23
    • 39749159619 scopus 로고    scopus 로고
    • 1550nm optical interconnect transceiver with low voltage electroabsorption modulators flip-chip bonded to 90nm CMOS
    • J. E. Roth, et al., "1550nm optical interconnect transceiver with low voltage electroabsorption modulators flip-chip bonded to 90nm CMOS," Proc. Opt. Fiber Commun. Nat. Fiber Optic Engineers Conf., Mar. 2007.
    • Proc. Opt. Fiber Commun. Nat. Fiber Optic Engineers Conf., Mar. 2007
    • Roth, J.E.1
  • 24
    • 0031153807 scopus 로고    scopus 로고
    • Wafer fusion: Materials issues and device results
    • Jun.
    • A. Black, et al., "Wafer fusion: materials issues and device results," IEEE J. Sel. Topics Quantum Electron., vol. 3, no. 3, pp. 943-951, Jun. 1997.
    • (1997) IEEE J. Sel. Topics Quantum Electron. , vol.3 , Issue.3 , pp. 943-951
    • Black, A.1
  • 25
    • 79956012595 scopus 로고    scopus 로고
    • Interface of directly bonded InP wafers for vertical couplers
    • Feb.
    • N. Y. Jin-Phillipp, et al., "Interface of directly bonded InP wafers for vertical couplers," Appl. Phys. Lett., vol. 80, no. 8, Feb. 2002.
    • (2002) Appl. Phys. Lett. , vol.80 , Issue.8
    • Jin-Phillipp, N.Y.1
  • 26
    • 13244265614 scopus 로고    scopus 로고
    • Continuous-tone grayscale mask fabrication using high-energy-beam- sensitive glass
    • T. Dillon et al., "Continuous-tone grayscale mask fabrication using high-energy-beam-sensitive glass," SPIE J. Microlithogr., Microfabrication Microsyst., vol. 3, 2004.
    • (2004) SPIE J. Microlithogr., Microfabrication Microsyst. , vol.3
    • Dillon, T.1
  • 27
    • 28344443542 scopus 로고    scopus 로고
    • 45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects,"
    • L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. Chen, "45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects," Appl. Phys. Lett., 87, 141110, 2005.
    • (2005) Appl. Phys. Lett. , vol.87 , pp. 141110
    • Wang, L.1    Wang, X.2    Jiang, W.3    Choi, J.4    Bi, H.5    Chen, R.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.