Prismatic coupling structure for intrachip global communication

IEEE Journal of Quantum Electronics

Volumn 45, Issue 4, 2009, Pages 388-395

  Gu, Tian ^a   Nair, Rohit ^a   Haney, Michael W ^a,b  

^a UNIVERSITY OF DELAWARE   (United States)

^b DEFENSE ADVANCED RESEARCH PROJECTS AGENCY   (United States)

Author keywords

Global interconnects; Multiple quantum well modulator (MQWM); Optical design; Optical interconnections

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMMUNICATION; ELECTRIC POWER SYSTEM INTERCONNECTION; INTEGRATED CIRCUITS; INTEGRATED OPTICS; INTEGRATED OPTOELECTRONICS; INTERCONNECTION NETWORKS; MODULATION; OPTICAL DESIGN; OPTICAL INTERCONNECTS; SEMICONDUCTOR QUANTUM WELLS;

BANDWIDTH REQUIREMENTS; CMOS TECHNOLOGIES; COUPLING EFFICIENCIES; COUPLING STRUCTURES; DEVICE INTEGRATIONS; FINITE-DIFFERENCE TIME-DOMAIN SIMULATIONS; GLOBAL COMMUNICATIONS; GLOBAL INTERCONNECTS; INTRACHIP; METAL INTERCONNECTIONS; METAL WIRES; MOORE'S LAWS; MULTIPLE QUANTUM-WELL MODULATOR (MQWM); OPTICAL INTERCONNECT; OPTICAL INTERCONNECTIONS; RAPID ADVANCEMENTS; RAY TRACES; STANDARD CMOS PROCESS;

LIGHT MODULATORS;

EID: 63649093867     PISSN: 00189197     EISSN: None     Source Type: Journal    
DOI: 10.1109/JQE.2009.2013213     Document Type: Article

References (30)

1. R. Ho, K. W. Mai, and M. A. Horowitz, "The future of wires," Proc. IEEE, vol. 89, no. 4, pp. 490-504, Apr. 2001.
2. K. Monnig, "The coming "red brick walls" in the ITRS interconnect roadmap," in Proc. IEEE-LEOS Summer Topical: Optical Interconnects VLSI Photon., San Diego, CA, Jul. 2004.
3. R. G. Beausoleil, J. Ahn, N. Binkert, A. Davis, D. Fattal, M. Fiorentino, N. P. Jouppi, M. McClaren, C. M. Santori, R. S. Schreiber, S. M. Spillane, D. Vantrease, and Q. Xu, "A nanophotonic interconnect for high-performance, many-core, computation," IEEE LEOS Newsletter pp. 15-22, Jun. 2008.
4. M. Iqbal, "Intrachip global communication - Evaluation of challenges and optical solution," Ph.D. dissertation, Dept. Elect. Comput. Eng., University of Delaware, Newark, DE, 2006.
5. D. A. B. Miller, "Rationale and challenges for optical interconnects to electronic chips," Proc. IEEE, vol. 88, no. 6, pp. 728-749, Jun. 2000.
6. M. W. Haney, M. J. McFadden, and M. Iqbal, "An application specific interconnect fabric (ASIF) for free-space global optical intra-chip interconnects," in Tech. Dig. Optics in Computing Topical Meeting Jun. 2003, pp. 105-107.
7. M. Iqbal, M. J. McFadden, and M. W. Haney, "Intrachip global interconnects and the saturation of Moore's law," in Proc. IEEE-LEOS Summer Topical: Opt. Interconnects VLSI Photon., San Diego, CA, Jul. 2004.
8. M. J. McFadden, M. Iqbal, T. Dillon, R. Nair, T. Gu, D. W. Prather, and M. W. Haney, "Multiscale free-space optical interconnects for intrachip global communication: Motivation, analysis, and experimental validation," Appl. Opt., vol. 45, no. 25, pp. 6358-6366, 2006.
9. M. Haurylau, G. Chen, H. Chen, J. Zhang, N. A. Nelson, D. H. Albonesi, E. G. Friedman, and P. M. Fauchet, "On-chip optical interconnect roadmap: Challenges and critical directions," IEEE J. Sel. Topics Quantum Electron., vol. 12, no. 6, pp. 1699-1705, Nov./Dec. 2006.
10. A. V. Krishnamoorthy and D. A. B. Miller, "Scaling optoelectronic-VLSI circuits into the 21st century: A technology roadmap," IEEE J. Sell. Topics Quantum Electron., vol. 2, no. 1, pp. 55-76, Apr. 1996.
11. K. W. Goossen, J. A. Walker, L. A. D'Asaro, S. P. Hui, B. Tseng, R. Leibenguth, D. Kossives, D. D. Bacon, D. Dahringer, L. M. F. Chirovsky, A. L. Lentine, and D. A. B. Miller, "GaAs MQW modulators integrated with silicon CMOS," IEEE Photon. Technol. Lett., vol. 7, no. 4, pp. 360-362, Apr. 1995.
12. M. A. Z. Rejman-Greene and E. G. Scott, "Two-dimensional arrays of InGaAs/InP MQW modulators," in Proc. IEE Colloq. Applications Quantum Wells Optoelectron., Jun. 1990, pp. 3/1-3/3.
13. J. E. Roth, S. Palermo, N. C. Helman, D. P. Bour, D. A. B. Miller, and M. A. Horowitz, "1550 nm optical interconnect transceiver with low voltage electroabsorption modulators flip-chip bonded to 90 nm CMOS," in Proc. Opt. Fiber Commun. Nat. Fiber Optic Engineers Conf,, Mar. 2007.
14. H. Q. Hou and T. Y. Chang, "Demonstration of wide-ternperature-range electroabsorption modulation near 1.5 μm using coupled quantum wells," Semicond. Sci. Technol., vol. 11, pp. 1429-1433, 1996.
15. T. H. Stievater, W. S. Rabinovich, P. G. Goetz, R. Mahon, and S. C. Binari, "A surface-normal coupled-quantum-well modulator at 1.55 μm," IEEE Photon. Technol. Lett., vol. 16, no. 9, pp. 2036-2038, Sep. 2004.
16. M. W. Haney, M. Iqbal, and M. J. McFadden, "Optical interconnects for intrachip global communication: Motivation and validation," in Proc. IEEE LEOS Annual Meet., Oct. 2005, pp. 206-207.
17. R. Nair, M. Iqbal, T. Gu, and M. W. Haney, "Coupling structure for intrachip optical global communication: Design and simulation," in Proc. IEEE LEOS Annual Meet., Oct. 2006, pp. 815-816.
18. S. I. Shim, K. T. Kim, K. M. Kim, H. D. Kim, S. E. Kim, H. T. Kim, and J. H. Park, "InP/InGaAsP multiple quantum well multimode interference coupler," J. Kor. Phys. Soci., vol. 38, no. 3, Mar. 2001.
19. H. Ma, A. K. Y. Jen, and L. R. Dalton, "Polymer-based optical waveguides: Materials, processing and devices," Adv. Mater., vol. 14, pp. 1339-1365, 2002.
20. L. Eldada and L. W. Shacklette, "Advances in polymer integrated optics," IEEE J. Sel. Topics Quantum Electron., vol. 6, no. 1, pp. 54-68, Jan./Feb. 2000.
21. R. Dangel et al., "Prospects of a polymer-waveguide-based board-level optical interconnect technology," Signal Propagation on Interconnects, pp. 131-134, May 2007.
22. C. Fan et al., "Digital free-space optical interconnections: A comparison of transmitter technologies," Appl. Opt., vol. 34, no. 17, pp. 3103-3115, Jun. 1995.
23. H. Liu, C.-C. Lin, and J. S. Harris, Jr., "High-speed, dual-function vertical cavity multiple quantum well modulators and photodetectors for optical interconnects," Opt. Eng., vol. 40, no. 7, pp. 1186-1191, Jul. 2001.
24. A. Black, A. R. Hawkins, N. M. Margalit D. I. Babic, A. L. Holmes, Jr., Y.-L. chang, P. Abraham, J. E. Bowers, and E. L. Hu, "Wafer fusion: Materials issues and device results," IEEE J. Sel. Topics Quantum Electron., vol. 3, no. 3, pp. 943-951, Jun. 1997.
25. N.Y. Jin-Philipp, B. Liu, J. E. Bowers, E. L. Hu, M. Kelsch, J. Thomas and M. Rühle, "Interface of directly bonded InP wafers for vertical couplers," Appl. Phys. Lett., vol. 80, no. 8, Feb. 2002.
26. T. Dillon, A. Sure, J. Murakowski, and D. Prather, "Continuous-tone grayscale mask fabrication using high-energy-beam-sensitive glass," SPIE J. Microlithogr., Microfabrication Microsyst., vol. 3, 2004.
27. C. M. Waits, A. Modafe, and R. Ghodssi, "Investigation of gray-scale technology for large area 3-D silicon MEMS structures," J. Micromech. Microeng., vol. 13, pp. 170-177, 2003.
28. 3 photoresists," Chalcogenide Lett., vol. 2. no. 4, Apr. 2005.
29. N. Bamiedakis et al., 'Low loss and low crosstalk multimode polymer waveguide crossings for high-speed optical interconnects," in Proc. Conf. Lasers and Electro-Opt., May 2007.
30. D. A. Zauner et al., "High-density multimode integrated polymer optics," J. Opt. A: Pure Appl. Opt., vol. 7, pp. 445-450, Aug. 2005.