160 Gb/s bidirectional polymer-waveguide board-level optical interconnects using CMOS-cased transceivers

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 2, 2009, Pages 345-359

  Doany, Fuad E ^a   Schow, Clint L ^a   Baks, Christian W ^a   Kuchta, Daniel M ^a   Pepeljugoski, Petar ^a   Schares, Laurent ^a   Budd, Russell ^a   Libsch, Frank ^a   Dangel, Roger ^b   Horst, Folkert ^b   Offrein, Bert J ^b   Kash, Jeffey A ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM RESEARCH ZURICH   (Switzerland)

Author keywords

Arrays; Assembly; Complementary metal oxide semiconductor (CMOS) analog integrated circuits; Integrated optoelectronics; Lenses; Optical fiber communication; Optical interconnections; Optical planar waveguides; Optical receivers; Optical transmitters; Optical waveguides; Optoelectronic packaging; Parallel optical interconnections

Indexed keywords

ARRAYS; COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) ANALOG INTEGRATED CIRCUITS; OPTICAL FIBER COMMUNICATION; OPTICAL INTERCONNECTIONS; OPTICAL PLANAR WAVEGUIDES; OPTICAL TRANSMITTERS; OPTOELECTRONIC PACKAGING; PARALLEL OPTICAL INTERCONNECTIONS;

ACOUSTIC RECEIVERS; ANALOG CIRCUITS; CHIP SCALE PACKAGES; CMOS INTEGRATED CIRCUITS; DATA TRANSFER; DIELECTRIC DEVICES; INTEGRATED CIRCUITS; INTEGRATED OPTICS; INTEGRATED OPTOELECTRONICS; LENSES; LINEAR INTEGRATED CIRCUITS; OPTICAL FIBER FABRICATION; OPTICAL FIBERS; OPTICAL INSTRUMENTS; OPTICAL INTERCONNECTS; OPTICAL LINKS; OPTICAL MATERIALS; OPTICAL RECEIVERS; OPTICAL SENSORS; OPTICAL WAVEGUIDES; PLANAR WAVEGUIDES; POLYMERS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; TRANSMITTERS; WAVEGUIDE COMPONENTS;

OPTICAL COMMUNICATION;

EID: 66749084412     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2014877     Document Type: Article

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