Interface of directly bonded InP wafers for vertical couplers

Applied Physics Letters

Volumn 80, Issue 8, 2002, Pages 1346-1348

  Jin Phillipp, N Y ^a   Liu, B ^b   Bowers, J E ^b   Hu, E L ^b   Kelsch, M ^c   Thomas, J ^c   Ruhle M ^c  

^a MAX PLANCK INSTITUT FÜR FESTKÖRPERFORSCHUNG   (Germany)

^b University of California   (United States)

^c MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDED INTERFACE; COUPLING LENGTH; DIRECT BONDING; DIRECT WAFER BONDING; INP WAFERS; MIS-ORIENTATION;

PHYSICAL PROPERTIES; PHYSICS;

WAFER BONDING;

EID: 79956012595     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1454216     Document Type: Article

References (9)

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