Multiscale optical design for global chip-to-chip optical interconnections and misalignment tolerant packaging

IEEE Journal on Selected Topics in Quantum Electronics

Volumn 9, Issue 2, 2003, Pages 548-556

  Christensen, Marc P ^a   Milojkovic, Predrag ^b   McFadden, Michael J ^c   Haney, Michael W ^c  

^a Southern Methodist University   (United States)

^b Applied Photonics Inc   (United States)

^c University of Delaware   (United States)

Author keywords

Optical design; Optical interconnections; Vertical cavity surface emitting lasers (VCSELs)

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; LASERS; OPTICAL DESIGN; OPTICAL LINKS; OPTICAL SYSTEMS; PHOTODETECTORS; PRINTED CIRCUIT BOARDS; TRANSISTORS;

GLOBAL CHIP-TO-CHIP OPTICAL INTERCONNECTIONS; MISALIGNMENT TOLERANT PACKAGING; MULTISCALE OPTICAL DESIGN; VERTICAL CAVITY SURFACE EMITTING LASERS;

OPTICAL INTERCONNECTS;

EID: 0242661476     PISSN: 1077260X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSTQE.2003.814414     Document Type: Article

References (10)

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