Characterization of metal-supported Al2O3 thin films by scanning electrochemical microscopy

Thin Solid Films

Volumn 518, Issue 14, 2010, Pages 3625-3631

  Battistel, Dario ^a   Daniele, Salvatore ^a   Gerbasi, Rosalba ^b   Baldo, M Antonietta ^a  

^a CA' FOSCARI UNIVERSITY OF VENICE   (Italy)

^b CNR   (Italy)

Author keywords

Amorphous alumina; Chemical etching; Metal organic chemical vapor deposition; Microelectrode; Scanning electrochemical microscopy

Indexed keywords

ALUMINA COATING; ALUMINA FILMS; ALUMINA LAYERS; AMORPHOUS ALUMINA; AQUEOUS MEDIA; CHEMICAL EFFECT; CHEMICAL ETCHING; CHEMICAL VAPOUR DEPOSITION; DISSOLUTION RATES; ELECTROLYSIS TIME; EXPERIMENTAL PARAMETERS; FLUORIDE ION; HIGH CONCENTRATION; HIGH SPATIAL RESOLUTION; LOCAL ATTACK; METAL ORGANIC; METALORGANIC CHEMICAL VAPOR DEPOSITION; PHYSIO-CHEMICAL PROPERTIES; SCANNING ELECTROCHEMICAL MICROSCOPY; SUBSTRATE DISTANCE; THICKNESS OF THE FILM;

AMORPHOUS FILMS; DEPOSITION; DISSOLUTION; ETCHING; INDUSTRIAL CHEMICALS; METAL RECOVERY; METALLORGANIC CHEMICAL VAPOR DEPOSITION; METALS; MICROELECTRODES; ORGANIC CHEMICALS; ORGANOMETALLICS; PLATINUM; SCANNING; SCANNING ELECTRON MICROSCOPY; SCANNING PROBE MICROSCOPY; STAINLESS STEEL; THIN FILMS;

ALUMINA;

EID: 77950616536     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.09.080     Document Type: Article

References (48)

1. Rajan T.P.D., Pilla R.M., and Pai B.C. J. Mater. Sci. 33 (1998) 3491
2. Masalski J., Gluszek J., Zabrzeski J., Nitsch K., and Gluszek P. Thin Solid Films 349 (1999) 186
3. Goswami B., Ray A.K., and Sahay S.K. High Temp. Mater. Process. 23 (2004) 73
4. Schaep J., Vandecasteele C., Peeters B., Luyten J., Dotremont C., and Roels D. J. Membr. Sci. 163 (1999) 229
5. Pilaski M., and Lohrengel M.M. Electrochim. Acta 48 (2003) 1309
6. Tripp M.K., Stampfer C., Miller D.C., Helbling T., Herrmann C.F., Hierold C., Gall K., George S.M., and Bright V.M. Sens. Actuators, A, Phys. 130-131 (2006) 419
7. Barreca D., Battiston G.A., Gerbasi R., and Tondello E. J. Mater. Chem. 10 (2000) 2127
8. Haanappel V.A.C., Vendel D.V.D., Metselaar H.S.C., van Corbach H.D., Fransen T., and Gelling P.J. Thin Solid Films 254 (1995) 153
9. Kuo D.H., Cheung B.-Y., and Wu R.-J. Thin Solid Films 398-399 (2001) 35
10. Wu L., Wu J., Zhao L., and Jiang C. Ceram. Int. 33 (2007) 747
11. Sundgren J.E., and Hentzell H.T.G. J. Vac. Sci. Technol. A4 (1986) 2259
12. Voigt M., and Sokolowski M. Mater. Sci. Eng., B, Solid-State Mater. Adv. Technol. 109 (2004) 99
13. Yoshitake M., Mebarki B., and Lay T.T. Surf. Sci. 511 (2002) L313
14. Guidi F., Moretti G., Carta G., Natali M., Rossetto G., Zanella P., Salmaso G., and Rigato V. Electrochim. Acta 50 (2005) 4609
15. Natali M., Carta G., Rigato V., Rossetto G., Salmaso G., and Zanella P. Electrochim. Acta 50 (2005) 4615
16. Emmerich R., Enders B., Martin H., Stippich F., Wolf G.K., Andersen P.E., Kudelha J., Lukac P., Hasuyama H., and Shima Y. Surf. Coat. Technol. 89 (1997) 47
17. Martin C.R. Adv. Mater. 15 (2003) 455
18. Cui X., Zhao Q., Li Z., Sun Z., and Jiang Z. Nanotechnology 18 (2007) 215701 5 pp.
19. Koh G., Agarwal S., Cheow P.S., and Toh C.S. Electrochim. Acta 52 (2007) 2815
20. Hagelsieb L.M., Lobert P.E., Pampin R., Bourgeois D., Remacle J., and Flandre D. Sens. Actuators, B, Chem. 98 (2004) 269
21. Battiston G.A., Daniele S., Dluzewski P., Gambirasi A., Gerbasi R., Rodriguez A., and Szczepanska A. Chem. Vapor Depos. Pat. 11 (2005) 187
22. Nahar R.K. Sens. Actuators, B, Chem. 63 (2000) 49
23. Makhlouf S.A., and Khalil K.M.S. Solid State Ionics 164 (2003) 97
24. Segda B.G., Jacquet M., and Besse J.P. Vacuum 62 (2001) 27
25. Lux B., Colombier C., Altena H., and Stjernberg K. Thin Solid Films 138 (1986) 49
26. Wang H.L., Lin C.H., and Hon M.H. Thin Solid Films 310 (1997) 260
27. Multone X., Borca C.N., and Hoffmann P. Thin Solid Films 515 (2007) 7542
28. Hitchman M.L., and Jensen K.F. Chemical vapour deposition principles and applications (1993), Academic Press, London
29. In: Bard A.J., and Mirkin M.V. (Eds). Scanning Electrochemical Microscopy (2001), Marcel Dekker, Inc, New York
30. Yatziv Y., Turyan I., and Mandler D. J. Am. Chem. Soc. 124 (2002) 5618
31. Sheffer M., and Mandler D. J. Electrochem. Soc. 155 (2008) D203
32. Zhang J., Slevin C., Morton C., Scott P., Walton D.J., and Unwin P.R. J. Phys. Chem., B 105 (2001) 11120
33. Quinn B.M., Prieto I., Haram S.K., and Bard A.J. J. Phys. Chem., B 105 (2001) 7474
34. Ruiz V., Liljeroth P., Quinn B.M., and Kontturi K. Nano Lett. 3 (2003) 1459
35. Nicholson P.G., Ruiz V., Macpherson J., and Unwin P.R. Phys. Chem. Chem. Phys. 8 (2006) 5096
36. Montenegro M.I., Queiros M.A., and Daschbach J.L. Microelectrodes: Theory and Applications, NATO ASI Series vol. E197 (1991)
37. Stulik K., Amatore C., Holub K., Marecek V., and Kutner W. Pure Appl. Chem. 72 (2000) 1483
38. Battiston G.A., and Gerbasi R. Chem. Vapor Depos. Pat. 8 (2002) 193
39. Daniele S., Battistel D., Gerbasi R., Benetollo F., and Battiston S. Chem. Vapor Depos. Pat. 13 (2007) 644
40. Saito Y. Rev. Polarogr. 15 (1968) 177
41. Sun P., Zhang Z., Guo J., and Shao Y. Anal. Chem. 73 (2001) 5346
42. Xiong H., Guo J., and Amemiya S. Anal. Chem. 79 (2007) 2735
43. Hocevar S., Daniele S., Bragato C., and Ogorevic B. Electrochim. Acta 53 (2007) 555
44. Nagayama M., and Tamura K. Electrochim. Acta 12 (1967) 1097
45. Mardilovich P.P., Govyadinov A.N., Mazurenko N.I., and Paterson R. J. Membr. Sci. 98 (1995) 143
46. Zhu M.X., Xie M., and Jiang X. Appl. Geochem. 21 (2006) 675
47. Valdivieso A.L., Bahena J.L.R., Song S., and Urbina R.H. J. Colloid Interface Sci. 298 (2006) 1
48. Xiong H., Gross D.A., Guo J., and Amemiya S. Anal. Chem. 78 (2006) 1946