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Volumn 33, Issue 1, 2010, Pages 16-24

Modeling heat transport in thermal interface materials enhanced with MEMS-based microinterconnects

Author keywords

MEMS; Numerical modeling; STAC interconnect; Thermal interface material; Thermal management

Indexed keywords

CHIP-LEVEL DESIGN; COMPLIANT INTERCONNECTS; COMPREHENSIVE DESIGNS; CONDUCTIVE EFFECTS; CONDUCTIVE PATHS; FABRICATION PROCESS; HEAT FLOWS; HEAT TRANSPORT; IN-SITU; INTERFACE MATERIALS; MEMS TECHNOLOGY; MULTI-CHIP; NUMERICAL MODELING; NUMERICAL RESULTS; PARAMETRIC STUDY; PERIODIC ELEMENTS; POLYMER MATRICES; SILICON DIE; TECHNICAL CHALLENGES; THERMAL ANALYSIS; THERMAL CONDUCTION; THERMAL INTERFACE MATERIAL; THERMAL INTERFACE MATERIALS; THERMAL MANAGEMENT; THERMAL PERFORMANCE; THERMAL RESISTANCE; THREE-AXIS; THROUGH SILICON VIAS; ULTRAHIGH DENSITY; WAFER LEVEL;

EID: 77949568320     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2018834     Document Type: Article
Times cited : (8)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.