Modeling heat transport in thermal interface materials enhanced with MEMS-based microinterconnects

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 1, 2010, Pages 16-24

  Zhou, Fan ^a   Arunasalam, Parthiban ^b,c   Murray, Bruce T ^d   Sammakia, Bahgat ^d  

^a NORTHWESTERN UNIVERSITY   (United States)

^b Microstaq Inc   (United States)

^c BINGHAMTON UNIVERSITY   (United States)

^d State University of New York at Binghamton   (United States)

Author keywords

MEMS; Numerical modeling; STAC interconnect; Thermal interface material; Thermal management

Indexed keywords

CHIP-LEVEL DESIGN; COMPLIANT INTERCONNECTS; COMPREHENSIVE DESIGNS; CONDUCTIVE EFFECTS; CONDUCTIVE PATHS; FABRICATION PROCESS; HEAT FLOWS; HEAT TRANSPORT; IN-SITU; INTERFACE MATERIALS; MEMS TECHNOLOGY; MULTI-CHIP; NUMERICAL MODELING; NUMERICAL RESULTS; PARAMETRIC STUDY; PERIODIC ELEMENTS; POLYMER MATRICES; SILICON DIE; TECHNICAL CHALLENGES; THERMAL ANALYSIS; THERMAL CONDUCTION; THERMAL INTERFACE MATERIAL; THERMAL INTERFACE MATERIALS; THERMAL MANAGEMENT; THERMAL PERFORMANCE; THERMAL RESISTANCE; THREE-AXIS; THROUGH SILICON VIAS; ULTRAHIGH DENSITY; WAFER LEVEL;

CARBON FIBER REINFORCED PLASTICS; CHIP SCALE PACKAGES; DESIGN; ELECTRONIC EQUIPMENT; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; FATIGUE OF MATERIALS; HEAT FLUX; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; MATERIALS; MEMS; MICROELECTROMECHANICAL DEVICES; NUMERICAL ANALYSIS; OPTIMIZATION; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; TECHNOLOGICAL FORECASTING; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF SOLIDS; THERMOANALYSIS;

THERMAL INSULATING MATERIALS;

EID: 77949568320     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2018834     Document Type: Article

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