Heat conduction in multilayered rectangular domains

Journal of Electronic Packaging

Volumn 129, Issue 4, 2007, Pages 440-451

  Geer, James ^a   Desai, Anand ^a   Sammakia, Bahgat ^a  

^a State University of New York   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; HEAT CONDUCTION; HEAT TRANSFER COEFFICIENTS; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY;

COMPUTER DEVICES; LATERAL SURFACES; THERMAL BOUNDARY CONDITIONS;

ELECTRONICS PACKAGING;

EID: 38749124358     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2804094     Document Type: Article

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