Design optimization of custom engineered silver-nanoparticle thermal interface materials

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 419-427

  Chhasatia, Viral ^a   Zhou, Fan ^a   Sun, Ying ^a   Huang, Liwei ^a   Wang, Howard ^a  

^a State University of New York   (United States)

Author keywords

Design optimization; Hot spot; Nanoparticles; Reliability; Thermal interface materials

Indexed keywords

ELECTRONIC EQUIPMENT; ELECTRONICS ENGINEERING; FIGHTER AIRCRAFT; FORMING; NANOPARTICLES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; NUCLEAR PROPULSION; OPTIMIZATION; ORGANIC POLYMERS; RELIABILITY; SURFACE ROUGHNESS; TECHNOLOGICAL FORECASTING; THERMOANALYSIS; THERMOELECTRICITY; THERMOMECHANICAL TREATMENT;

DESIGN OPTIMIZATION; HOT SPOT; HOT SPOTTING; THERMAL INTERFACE MATERIALS;

SILVER;

EID: 50949112581     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544300     Document Type: Conference Paper

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