Models of steady heat conduction in multiple cylindrical domains

Journal of Electronic Packaging

Volumn 128, Issue 1, 2006, Pages 10-17

  Desai, Anand ^a   Geer, James ^a   Sammakia, Bahgat ^a  

^a State University of New York   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; HEAT SINKS; MATHEMATICAL MODELS; THERMAL CONDUCTIVITY; THICKNESS MEASUREMENT;

AXISYMMETRIC; CONVECTIVE COOLING; CYLINDRICAL DOMAINS; THERMAL MANAGEMENT;

HEAT CONDUCTION;

EID: 33645970432     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2159003     Document Type: Article

References (7)

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3. Youvanovich, M. M., Culham, J. R., and Teertstra, P., 1998, "Analytical modeling of Spreading Resistance in Flux Tubes, Half Spaces and Compound Disks," IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 21(1), pp. 168-176.
4. Negus, K. J., Youvanovich, M. M., and Thompson, J. C., 1988, "Constriction resistance of Circular Contacts on Coated Surfaces: Effect of Boundary Conditions," J. Thermophys. Heat Transfer, 2(2), pp. 158-164.
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6. Song, S., Lee, S., and Au, V., 1994, "Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition," IEPS Conference, pp. 111-121.
7. Kennedy, D. P., 1940, "Spreading Resistance in Cylindrical Semiconductor Devices," J. Appl. Phys., 31(8), pp. 1490-1497.