Thermo-mechanical analysis of thru-silicon-via based high density compliant interconnect

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1179-1185

  Amnasalam, Parthiban ^a   Fan, Zhou ^a   Ackler, Harold D ^a   Sammakia, Bahgat G ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FORCE DEFLECTION CURVE; SILICON CHIPS; THERMOMECHANICAL ANALYSIS;

INTERCONNECTION NETWORKS; MATHEMATICAL MODELS; MICROSTRUCTURE; SEMICONDUCTING SILICON;

CHIP SCALE PACKAGES;

EID: 35348890136     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373943     Document Type: Conference Paper

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