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Journal of Vacuum Science and Technology B

Volumn 28, Issue 1, 2010, Pages 82-85

Sub- 200 nm gap electrodes by soft UV nanoimprint lithography using polydimethylsiloxane mold without external pressure

(4) Hamouda, F a Barbillon, G a Gaucher, F a Bartenlian, B a

a UNIVERSITÉ PARIS SACLAY (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODES; ELECTRON BEAM LITHOGRAPHY; MICROCHANNELS; MOLDS; NANOIMPRINT LITHOGRAPHY; REACTIVE ION ETCHING; SILICONES;

BI-LAYER; ELECTRON-BEAM LITHOGRAPHY; EXTERNAL PRESSURES; FLEXIBLE MOLDS; MOLD MATERIALS; REACTIVE-ION ETCHING; SAMPLE SIZES; SIMPLE++; ULTRAVIOLET-NANOIMPRINT LITHOGRAPHY; UV-NANOIMPRINT LITHOGRAPHY;

POLYDIMETHYLSILOXANE;

EID: 77949391414 PISSN: 10711023 EISSN: None Source Type: Journal
DOI: 10.1116/1.3273535 Document Type: Conference Paper

Times cited : (9)

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