Characterisation of the fabrication process of freestanding SU-8 microstructures integrated in printing circuit board in microelectromechanical systems

Micro and Nano Letters

Volumn 5, Issue 1, 2010, Pages 7-13

  Perdigones, F ^a   Moreno, J M ^a   Luque, A ^a   Quero, J M ^a  

^a UNIVERSIDAD DE SEVILLA   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION ENERGY; CHARACTERISATION; COPPER STRUCTURES; CUPRIC CHLORIDE; FABRICATION PROCESS; FR4 SUBSTRATES; ISOTROPIC ETCHING; MICRO ELECTRO MECHANICAL SYSTEM; MICRO-CANTILEVERS; MICROBRIDGES; MICROMEMBRANES; PCB MEMS; PRINTING CIRCUIT BOARD; RESIDUAL THERMAL STRESS; SU-8 MICROSTRUCTURES; SU-8 STRUCTURE; SURFACE ENERGIES;

CHLORINE COMPOUNDS; COMPOSITE MICROMECHANICS; ETCHING; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; PRINTING; SUBSTRATES; SURFACE CHEMISTRY; SURFACE TENSION;

FABRICATION;

COPPER; CUPRIC CHLORIDE; POLYMER;

ADHESION; ARTIFICIAL MEMBRANE; ENERGY; FLUID FLOW; MICROELECTROMECHANICAL SYSTEMS TECHNOLOGY; NANOTECHNOLOGY; REVIEW; SURFACE PROPERTY; TEMPERATURE STRESS;

EID: 77149127419     PISSN: None     EISSN: 17500443     Source Type: Journal    
DOI: 10.1049/mnl.2009.0097     Document Type: Review

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