Versatile low temperature wafer bonding and bond strength measurement by a blister test method

Microsystem Technologies

Volumn 12, Issue 5, 2006, Pages 418-429

  Doll, Alexander ^a   Rabold, Martin ^a   Goldschmidtböing, Frank ^a   Woias, Peter ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BOND STRENGTH (CHEMICAL); BONDING; COMPUTER SIMULATION; CRACK PROPAGATION; SILICON NITRIDE;

ANNEALING TEMPERATURES; SILICON NITRIDE WAFERS; SILICON-TO-SILICON OXIDE WAFER;

SILICON WAFERS;

EID: 33645163107     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-005-0030-x     Document Type: Conference Paper

References (8)

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