Comparison of Sn2.8Ag20ln and Sn10Bi10ln solders for intermediate-step soldering

Journal of Electronic Materials

Volumn 35, Issue 11, 2006, Pages 1975-1981

  Seo, Sun Kyoung ^a   Cho, Moon Gi ^a   Lee, Hyuck Mo ^a   Choi, Won Kyoung ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Hermetic sealing; Ni 28Sn 55In 17; Sn10Bi10In; Sn2.8Ag20In; Step soldering

Indexed keywords

HERMETIC SEALING; SN10BI10IN; SN2.8AG20IN; STEP SOLDERING;

METALLURGY; REACTION KINETICS; SOLDERED JOINTS; SOLDERING; THERMODYNAMIC PROPERTIES; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 33845744401     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0302-y     Document Type: Conference Paper

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