A comprehensive shear-testing facility for joint-scale solder samples

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Volumn , Issue , 2008, Pages

  Herkommer, Dominik ^a   Reid, Michael ^a   Punch, Jeff ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CREEP; ELECTRONICS INDUSTRY; EXPERIMENTS; INDUSTRIAL ENGINEERING; MICROELECTRONICS; PROCESS ENGINEERING; TEST FACILITIES; WELDING;

DESIGN FEATURES; IN-SITU OBSERVATIONS; INTERNATIONAL CONFERENCES; MANUFACTURING PROCESSES; MICRO-STRUCTURAL; MICRO-SYSTEMS; MULTI-PHYSICS SIMULATION; ROOM TEMPERATURES; SECONDARY CREEP; SHEAR TESTING; SOLDER JOINTS; TEST RESULTS; TESTING FACILITY; TESTING METHODS; TRANSITION TIMES;

CREEP TESTING;

EID: 49249124608     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2008.4525011     Document Type: Conference Paper

References (11)

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