Determination of the Anand viscoplasticity model constants for SnAgCu

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1263-1270

  Rodgers, Bryan ^a   Punch, Jeff ^a   Flood, Ben ^a   Waldron, Finbarr ^b  

^a UNIVERSITY OF LIMERICK   (Ireland)

^b UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SOLDERING; STRAIN MEASUREMENT; TEMPERATURE DISTRIBUTION; TIN COMPOUNDS;

DISPLACEMENT RATE LOADING; FITTED ANAND MODEL; STRESS-PLASTIC STRAIN CURVE;

VISCOPLASTICITY;

EID: 32844467140     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73352     Document Type: Conference Paper

References (16)

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