Stress relaxation characterization of hypoeutectic Sn3.0Ag0.5Cu pb-free solder: Experiment and modeling

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Volumn , Issue , 2007, Pages

  Cuddalorepatta, Gayatri ^a   Herkommer, Dominik ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENCHMARKING; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; STRESS RELAXATION; TEMPERATURE MEASUREMENT; VISCOPLASTICITY;

BENCHMARK EUTECTICS; CREEP BEHAVIOR; FINITE ELEMENT MODELS; MICRONS;

SOLDERING ALLOYS;

EID: 36348970075     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.360038     Document Type: Conference Paper

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