In-situ solder fatigue studies using a Thermal Lap Shear Test

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 396-403

  Dudek, Rainer ^a   Faust, Wolfgang ^a   Vogel, Juergen ^b   Michel, Bernd ^a  

^a FRAUNHOFER IZM   (Germany)

^b AMIC Angewandte Micro Messtechnik GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MICROSCOPES; SOLDERING; THERMAL EXPANSION;

SOLDER FATIGUE; THERMO-MECHANICAL FATIGUE;

ELECTRONICS PACKAGING;

EID: 28444443426     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Vogel, D., Kühnert, R., Dost, M., Michel, B., Determination of Packaging Material Properties Utilizing Image Correlation Techniques, Journal of Electronic Packaging, December 2002, Vol. 124, 345-351
2. Schubert, A., Dudek, R., Auerswald, E., Gollhardt, A., Michel, B., Reichl, B., "Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation", Proceedings, 53rd Electronic Components & Technology Conference, 2003, pp. 603-610
3. Dudek, R., Nylen, M., Schubert, A., Michel, B., and Reichl, H., "An Efficient Approach to Predict Solder Fatigue Life and its Application to SM- and Area Array Components", Proceedings, 47th Electronic Components & Technology Conference, San Jose, May 1997, pp. 462-471
4. Dudek, R., Walter, H., Doling, R., Michel, B., "Thermal Fatigue Modelling for SnAgCu and SnPb Solder Joints", Proceedings EuroSimE 2004, Brussels, Belgium, May 2004, pp. 557-564
5. Dunford, S., Canumalla, S., Viswanaham, P., "Intermetallic Morphology and Damage Evolution Under Thermomechanical Fatigue of Lead(Pb)-Free Solder Interconnections", Proceedings, 54th Electronic Components & Technology Conference, 2004, pp. 726-736