In-situ optical creep observation and constitutive modelling of joint-scale SAC solder shear samples

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 506-515

  Herkommer, Dominik ^a   Reid, Michael ^a   Punch, Jeff ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CREEP; ELECTRONICS PACKAGING; WELDING;

CAMERA SYSTEMS; CONSTITUTIVE MODELLING; CREEP TESTS; DEFORMATION MECHANISMS; IN-SITU; LEAD-FREE; OPTICAL OBSERVATIONS; QUANTITATIVE DATUM; SAC-SOLDERS; SURFACE EFFECTS; TEST CONDITIONS; VISCO-PLASTIC MODELS;

TESTING;

EID: 63049140174     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763484     Document Type: Conference Paper

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