EBSD characterization of twinned copper using pulsed electrodeposition

Journal of Physics D: Applied Physics

Volumn 42, Issue 21, 2009, Pages

  Lui, Guan Tai ^a   Chen, Delphic ^a   Kuo, Jui Chao ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE GRAIN SIZE; COPPER FILMS; CRYSTALLOGRAPHIC MICROSTRUCTURE; CU FILMS; ELECTRON BACK SCATTER DIFFRACTION; GRAIN SIZE; HIGH-DENSITY; IMAGE MAPS; NANOTWINS; PREFERRED ORIENTATIONS; PULSE CURRENTS; PULSED ELECTRODEPOSITION; PULSED ELECTRODEPOSITION TECHNIQUES; TWIN PLANES;

COPPER PLATING; ELECTRODEPOSITION; ELECTRON DIFFRACTION; GRAIN SIZE AND SHAPE; METALLIC FILMS; MICROSTRUCTURE; X RAY DIFFRACTION ANALYSIS;

COPPER;

EID: 70450207447     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/42/21/215410     Document Type: Article

References (24)

1. Lu L, Shen Y F, Chen X H, Qian L H and Lu K 2004 Ultrahigh strength and high electrical conductivity in copper Science 304 422-6
2. Ma E, Wang Y M, Lu Q H, Sui M L, Lu L and Lu K 2004 Strain hardening and large tensile elongation in ultrahigh-strength nano-twinned copper Appl. Phys. Lett. 85 4932-4
3. Popov K I, Keca D N and Vuksanovic B I 1977 Formation of powdered copper deposits by constant and pulsating overpotential electrolysis J. Appl. Electrochem. 7 77-80
4. Lingk C and Gross M E 1998 Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature J. Appl. Phys. 84 5547-53
5. Harper J M E, Cabral C, Andricacos P C, Gignac L, Noyan I C, Rodbell K P and Hu C K 1999 Mechanisms for microstructure evolution in electroplated copper thin films near room temperature J. Appl. Phys. 86 2516-25 (Pubitemid 129308611)
6. Brongersma S H, Richard E, Vervoort I, Bender H, Vandervorst W, Lagrange S, Beyer G and Maex K 1999 Two-step room temperature grain growth in electroplated copper J. Appl. Phys. 86 3642-5
7. Hau-Riege S P and Thompson C V 2000 In situ transmission electron microscope studies of the kinetics of abnormal grain growth in electroplated copper films Appl. Phys. Lett. 76 309-11
8. Zhang X, Tu K N, Chen Z, Tan Y K, Wong C C, Mhaisalkar S G, Li X M, Tung C H and Cheng C K 2008 J. Nanosci. Nanotechnol. 8 2568-74
9. Damjanovic A 1965 On the mechanism of metal electrocrystallization Plating 52 1017-26
10. Krushev L, Pangarova V and Pangarov N 1968 The effect of crystal orientation on the strength of copper deposited at high current densities Plating 55 841-2
11. Pangarov N A 1965 Preferred orientations in electro-deposited metals J. Electroanal. Chem. 9 70-85
12. Hong B, Jiang C H and Wang X J 2007 Influence of complexing agents on texture formation of electrodeposited copper Surf. Coat. Technol. 201 7449-52
13. Cui B Z, Han K, Xin Y, Waryoba D R and Mbaruku A L 2007 Highly textured and twinned Cu films fabricated by pulsed electrodeposition Acta Mater. 55 4429-38
14. Zhang X, Misra A, Wang H, Shen T D, Nastasi M, Mitchell T E, Hirth J P, Hoagland R G and Embury J D 2004 Enhanced hardening in Cu/330 stainless steel multilayers by nanoscale twinning Acta Mater. 52 995-1002
15. Xu L H, Dixit P, Miao J M, Pang H L, Zhang X, Tu K N and Preisser R 2007 Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins Appl. Phys. Lett. 90 033111
16. Xu D et al 2008 Microelectron. Eng. 85 2155-8
17. Zhang X, Tu K N, Chen Z, Tan Y K, Wong C C, Mhaisalkar S G, Li X M, Tung C H and Cheng C K 2008 J. Nanosci. Nanotechnol. 8 2568-74
18. Chandrasekar M S and Pushpavanam M 2008 Pulse and pulse reverse plating-conceptual, advantages and applications Electrochim. Acta 53 3313-22
19. Barrett C S and Massalski T B 1980 Structure of Metals Crystallographic Methods, Principles and Data (New York: Pergamon)
20. Matsushima H, Bunda A, Plieth W, Kikuchi S and Fukunaka Y 2007 Copper electrodeposition in a magnetic field Electrochim. Acta 53 161-6
21. Maurer F, Broetz J, Karim S, Molares M E T, Trautmann C and Fuess H 2007 Preferred growth orientation of metallic fcc nanowires under direct and alternating electrodeposition conditions Nanotechnology 18 135709
22. Shen Y F, Lu L, Lu Q H, Jin Z H and Lu K 2005 Tensile properties of copper with nano-scale twins Scr. Mater. 52 989-94
23. Oldham H B and Myland J C 1994 Fundamentals of Electrochemical Science (New York: Academic)
24. Tsai W C, Wan C C and Wang Y Y 2002 Mechanism of copper electrodeposition by pulse current and its relation to current efficiency J. Appl. Electrochem. 32 1371-8