Bonding interfaces in wafer-level metal/adhesive bonded 3D integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 871-878

  McMahon, J J ^a   Chan, E ^a   Lee, S H ^a   Gutmann, R J ^a   Lu, J Q ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; BUTENES; COMPUTER NETWORKS; COPPER; CURING; DEFECTS; ENGINEERING GEOLOGY; INTEGRATED CIRCUITS; SURFACE DEFECTS; SURFACE TOPOGRAPHY; TANTALUM; THREE DIMENSIONAL;

BONDING INTERFACES; ELECTRONIC COMPONENTS; WAFER LEVELS;

WAFER BONDING;

EID: 51349160262     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550079     Document Type: Conference Paper

References (24)

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