Can micro-compression testing provide stress-strain data for thin films?. A comparative study using Cu, VN, TiN and W coatings

Thin Solid Films

Volumn 518, Issue 5, 2009, Pages 1517-1521

  Dehm, G ^a,b   Worgotter H P ^c   Cazottes, S ^a   Purswani, J M ^d   Gall, D ^d   Mitterer, C ^b   Kiener, D ^a  

^a ERICH SCHMID INSTITUTE OF MATERIALS SCIENCE   (Austria)

^b UNIVERSITY OF LEOBEN   (Austria)

^c MATERIALS CENTER LEOBEN FORSCHUNG GMBH   (Austria)

^d RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Hard coating; Micro compression; Nanoindentation; Thin film

Indexed keywords

COMPARATIVE STUDIES; COMPRESSION TESTS; FILM-SUBSTRATE SYSTEMS; FLAT PUNCHES; FLOW STRESS; FOCUSSED ION BEAM MILLINGS; IN-SITU; LINEAR WORKS; MATERIAL DEFECT; MICRO-COMPRESSION; MODULUS MEASUREMENTS; NANOINDENDATION; NANOINDENTERS; POLYCRYSTALLINE; SCANNING ELECTRON MICROSCOPE; SI(0 0 1); STATISTICAL SCATTER; STRESS-STRAIN DATA; STRESS-STRAIN RESPONSE; W COATING;

COMPRESSION TESTING; HARD COATINGS; HARDNESS TESTING; MATERIALS TESTING; NANOINDENTATION; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SINGLE CRYSTALS; STATISTICAL TESTS; STRESS-STRAIN CURVES; THIN FILM DEVICES; THIN FILMS; TITANIUM COMPOUNDS; TITANIUM NITRIDE;

COPPER;

EID: 70449487683     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.09.070     Document Type: Article

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