Stress and texture in HIPIMS TiN thin films

Thin Solid Films

Volumn 518, Issue 5, 2009, Pages 1561-1565

  Machunze, R ^a   Ehiasarian, A P ^b   Tichelaar, F D ^c   Janssen, G C A M ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b SHEFFIELD HALLAM UNIVERSITY   (United Kingdom)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

HIPIMS; Ion bombardment; Stress; Texture; TiN; Titanium nitride

Indexed keywords

DEPOSITION MODES; ENERGETIC ION; FILM STRESS; FILM TEXTURES; GROUNDED SUBSTRATES; HIGH-POWER; HIPIMS; ION BOMBARDMENT ENERGY; REACTIVE MAGNETRON SPUTTERING; SILICON SUBSTRATES; TIN FILMS; TIN THIN FILMS;

CRACK INITIATION; FILM GROWTH; IONS; MAGNETRONS; METALLIC FILMS; SUBSTRATES; TEXTURES; TITANIUM; TITANIUM NITRIDE;

ION BOMBARDMENT;

EID: 70449471124     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.09.069     Document Type: Article

References (29)

1. Pierson H. Handbook of Refractory Carbides and Nitrides (1996), Noyes Publications
2. Bohlmark J., Lattemann M., Stranning H., Selinder T., Carlsson J., and Helmersson U. Society of Vacuum Coaters 49th Annual Technical Conference Proceedings (2006) 334
3. Ehiasarian A.P., New R., Münz W.-D., Hultman L., Helmersson U., and Kouznetsov V. Vacuum 65 (2002) 147
4. Paulitsch J., Mayrhofer P.H., Münz W.-D., and Schenkel M. Thin Solid Films 517 (2008) 1239
5. Petrov I., Barna P.B., Hultman L., and Greene J.E. J. Vac. Sci. Technol. A 21 5 (2003) 117
6. Machunze R., and Janssen G.C.A.M. Thin Solid Films 517 (2008) 5888
7. Vetushka A., and Ehiasarian A.P. J. Phys., D. Appl. Phys. 41 (2008) 015204
8. Stöcker H. Taschenbuch der Physik. Verlag Harri Deutsch (2000)
9. Suurmeijer E.P.Th.M., Mulder T., and Verhoeven J. Basisboek Vacuümtechniek (2000), NEVAC
10. Janssen G.C.A.M., Abdalla M.M., van Keulen F., Pujada B.R., and vanVenrooy B. Thin Solid Films 517 6 (2009) 1858
11. Petrov I., Hultman L., Helmersson U., Sundgren J.-E., and Greene J.E. Thin Solid Films 169 (1989) 299
12. Chapman B. Glow Discharge Processes (1980), John Wiley & Sons
13. Y. Aranda-Gonzalvo, A.P. Ehiasarian, private communication, (2009).
14. Hecimovic A., Burcalova K., and Ehiasarian A.P. J. Phys., D, Appl. Phys. 41 (2008) 095203
15. Petrov I., Hultman L., Sundgren J.-E., and Greene J.E. J. Vac. Sci. Technol. A 10 2 (1992) 265
16. Ehiasarian A.P., Münz W.-D., Hultman L., Helmersson U., and Petrov I. Surf. Coat. Technol. 163 (2003) 267
17. Gall D., Kodambaka S., Wall M.A., Petrov I., and Greene J.E. J. Appl. Phys. 93 11 (2003) 9086
18. Mahieu S., and Depla D. J. Phys. D Appl. Phys. 42 (2009) 053002
19. Hultman L., Sundgren J.-E., Greene J.E., Bergstrom D.B., and Petrov I. J. Appl. Phys. 78 (1995) 5395
20. Volkert C.A., Alofs C.F., and Liefting J.R. J. Mater. Res. 9 (1994) 1147
21. Mayrhofer P.H., Kunc F., Musil K., and Mitterer C. Thin Solid Films 415 (2002) 151
22. Abadias G. Surf. Coat. Technol. 202 11 (2008) 2223
23. Guruvenket S., and MohanRao G. J. Vac. Sci. Technol. A 20 3 (2002) 678
24. Abadias G., and Tse Y.Y. J. Appl. Phys. 95 5 (2004) 2414
25. Ehiasarian A.P., Gonzalvo Y.A., and Whitmore T.D. Plasma Process. Polym. 4 S1 (2007) 309
26. Window B. J. Vac. Sci. Technol. A 11 4 (1993) 1522
27. Sarakinos K., Alami J., Karimi P., Severin D., and Wuttig M. J. Phys. D Appl. Phys. 40 (2007) 778
28. Abadias G., and Guerin P. Appl. Phys. Lett. 93 (2008) 111908
29. Machunze R., and Janssen G.C.A.M. Surf. Coat. Technol. 203 (2008) 550