Stress gradients in titanium nitride thin films

Surface and Coatings Technology

Volumn 203, Issue 5-7, 2008, Pages 550-553

  Machunze, R ^a   Janssen, G C A M ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

PVD; Stress; Stress gradient; TiN; Titanium nitride

Indexed keywords

BENDING (DEFORMATION); ETCHING; HARD COATINGS; MAGNETRON SPUTTERING; NITRIDES; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SILICON WAFERS; THICK FILMS; TIN; TITANIUM; TITANIUM COMPOUNDS;

AVERAGE STRESSES; NITRIDE THIN FILMS; PVD; REACTIVE UNBALANCED MAGNETRON SPUTTERING; STRESS GRADIENT; STRESS GRADIENTS; THINNER FILMS; TITANIUM NITRIDE FILMS; WET CHEMICALS;

TITANIUM NITRIDE;

EID: 55749085658     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2008.05.005     Document Type: Article

References (7)

1. Janssen G.C.A.M., Dammers A.J., Sivel V.G.M., and Wang W.R. Appl. Phys. Lett. 83 (2003) 3287
2. Köstenbauer H., Fontalvo G.A., Kapp M., Keckes J., and Mitterer C. Surf. Coat. Technol. 201 (2007) 4777
3. Janssen G.C.A.M. Thin Solid Films 515 (2007) 6654
4. Jones D.A. Principles and prevention of corrosion. 2nd ed. (1996), Prentice Hall, Upper Saddle River
5. Masters C.B., and Salamon N.J. Int. J. Eng. Sci. 31 (1993) 915
6. Ohring M. The Materials Science of Thin Films (1992), Academic Press, San Diego 416
7. Abadias G. Surf. Coat. Technol. 202 (2008) 2223