Mechanical characterization of thermal SiO2 micro-beams through tensile testing

Journal of Micromechanics and Microengineering

Volumn 19, Issue 9, 2009, Pages

  Chu, Jinkui ^a   Zhang, Duanqin ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; COMPRESSIVE RESIDUAL STRESS; FRACTURE STRENGTHS; GRIPPING METHODS; IN-SITU; LOAD-DISPLACEMENT CURVE; MECHANICAL CHARACTERIZATIONS; MICRO BEAMS; SPRING BEAMS; SPRING MODEL; STIFFNESS COEFFICIENTS; YOUNG'S MODULUS;

ALIGNMENT; ELASTIC MODULI; ELASTICITY; FRACTURE; INDUCTIVELY COUPLED PLASMA; MATERIALS TESTING APPARATUS; MECHANICAL PROPERTIES; RESIDUAL STRESSES; SILICON COMPOUNDS; TENSILE STRENGTH;

TENSILE TESTING;

EID: 70350633123     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/9/095020     Document Type: Article

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